Electrodeposition is the method of plating metal into another by hydrolysis generally to protect against corrosion metal. In Zinc Electroplating, deposited on steel, where acts as a sacrificial element that enhances Steel’s life. The zinc electroplating methods are mostly affected process parameters such current, temperature, voltage, etc. Hydrogen absorbed in plated layer and later it causes c...

The semiconductor industry is headed towards a new era of scaling and uncertainty with new key building blocks for the next-generation chips, the high-κ metal-gate transistor. There is a need for statistical characterization of high-κ metal-gate digital gates as a function of process parameter variations to make them available for designers. In this paper, we present a methodology for PVT aware...

Supported metal oxide based olefin metathesis catalysts are widely used in the chemical industry. In comparison to their organometallic catalyst cousins, the oxide catalysts have much lower activity due to the very small fraction of active sites. We report that a simple pretreatment of MoO3/SiO2 and WO3/SiO2 under an olefincontaining atmosphere at elevated temperatures leads to a 100−1000fold i...

Workers in the road construction industry include asphalt plant, ground construction, and road paving workers. These individuals can be exposed to a wide range of potentially hazardous substances. A summary of levels of exposure to different substances measured during road construction is presented. In modern road paving, workers typically are exposed to 0.1 to 2 mg/m3 of bitumen fume, which in...

Metal fiber porous materials with intrinsic properties of metal and functional properties of porous materials have received a great deal of attention in the fundamental research and industry applications. With developments of the preparation technologies and industrial requirements, porous fiber metals with excellent properties are developed and applied in many industry areas, e.g., sound absor...

The mechanism of copper (Cu) voids formation from electro-chemical plating (ECP) followed by Cu chemical mechanical polishing (CMP) are studied in Cu dual-damascene interconnection. The formation of Cu voids at metal lines is the main problem that causes not only the failure of via-induced metal-island corrosion but also yield loss. The galvanic theory and Cu lifting mechanism are proposed to e...

A novel method is presented to fabricate high-resolution, high-aspect ratio metal wires embedded in a plastic substrate for flexible electronics applications. In a sequential process, high-resolution channels connected to low-resolution reservoirs are first created in a thermosetting polymer by imprint lithography. A reactive Ag ink is then inkjet-printed into the reservoirs and wicked into the...

A 28-year-old female presented for evaluation of left flank pain and polyuria after having been exposed to cadmium in the jewelry manufacturing industry for approximately 3 years. This patient possessed both elevated 24-hr urinary ss2-microglobulin and elevated blood cadmium levels. Approximately 6 months after initial presentation, the patient resigned from her job due to shortness of breath, ...

Incorporation of sulfur into 2.4 T CoFe alloys during galvanostatic deposition has been studied. The results indicate that the main source of sulfur in magnetic deposit is saccharin used as an additive in the plating solution. The atomic percent of sulfur in deposit and the sulfur incorporation rate show strong dependence on saccharin concentration in the plating solution. This dependence has p...

Here, we report a nanopipette-based electrochemical approach to prepare metal nanoelectrodes with excellent control over electrode size, shape, and thickness of the insulation wall. Nanoelectrodes are prepared by electrochemical plating in a laser-pulled quartz nanopipette tip immersed in a liquid gallium/indium alloy electrode, which not only protects the ultrasmall quartz tip but also starts ...