In this pa er we describe a process for the micromachining of materials like Teflon-FEP. We have used photolithography and plasma etching, by which electrets can be etched selemvely. The advantages of, in such a way micromachined electrets are numerous. Miniature sensors like microphones and pressure sensors, containi6 local areas with Teflon, have been realized in our laboratones. The process ...

Silicon micromachined terahertz passive components such as silicon washers, waveguide blocks for W-band (75-110 GHz) power amplifiers, and waveguides for 325-500 GHz band have been designed, microfabricated, and characterized. Based on these results, an integrated 600 GHz silicon micromachined RadiometerOn-a-Chip (ROC) has been demonstrated for the first time. It reduced in mass by an order of ...

This paper presents a single wafer, all-silicon, high aspect-ratio multi-layer polysilicon micromachining technology that combines deep dry etching of silicon with conventional surface micromachining to realize tens to hundreds of microns thick, high aspect-ratio, electrically isolated polysilicon structures with sub-micron air-gaps. Vertical polysilicon sense electrodes as tall as the main bod...

Diatoms are microscopic, single-celled algae that possess rigid cell walls (frustules) composed of amorphous silica. Depending on the species of diatom and the growth conditions, these frustules can display a wide range of different morphologies. It is possible to design and produce specific frustule morphologies that have potential applications in nanotechnology.

The FIB Instrument The basic functions of the FIB, namely, imaging and sputtering with an ion beam, require a highly focused beam. A consistent tenet of any focused beam is that the smaller the effective source size, the more current that can be focused to a point. Unlike the broad ion beams generated from plasma sources, high-resolution ion beams are defined by the use of a field ionization so...

Thin film integrated optics components such as light guides, modulators, directional couplers, and polarizers demand high quality edge smoothness and high resolution pattern formation in dimensions down to submicrometer size. Fabrication techniques combining holographic and scanning electron beam lithography with ion beam micromachining have produced planar phase gratings with intervals as smal...

Recent process developments have permitted the highly anisotropic bulk micromachining of titanium microelectromechanical systems (MEMS). By using the metal anisotropic reactive ion etching with oxidation (MARIO) process, arbitrarily high-aspect-ratio structures with straight sidewalls and micrometre-scale features have been bulk micromachined into titanium substrates of various thicknesses, ran...

Interest in thick-photoresist applications is steadily growing. In addition to bump fabrication and wire interconnect technology (WIT), the process of patterning thick-layer photoresists by UV lithography is specially qualified for applications in microelectromechanical systems (MEMS). Specialized equipment and new photoresists have been developed or are under development to cope with the new c...

The use of low-energy femtosecond laser beam combined with chemical etching has been proven to be an efficient method to fabricate three-dimensional structures in fused silica. For high-volume application, this technology--like other serial processes--suffers from a moderate production rate. Here, we show that femtosecond laser can also be employed to fabricate silica molds and other patterned ...