This work describes a way to apply 3D Finite Element (FE) analysis to the thermal design of power electronic modules using simplified geometry models of the system components. The method here presented can overcome the problem of solving equation systems with a very high number of Degrees Of Freedom (DOF) due to complex geometry of a power module.

assume that $a$‎, ‎$b$ are banach algebras and that $m:atimes brightarrow b$‎, ‎$m^prime:atimes arightarrow b$ are bounded bilinear mappings‎. ‎we study the relationships between arens regularity of $m$‎, ‎$m^prime$ and the banach algebras $a$‎, ‎$b$‎. ‎for a banach $a‎$‎-bimodule $b$‎, ‎we show that $b$ factors with respect to $a$ if and only if $b^{**}$ is unital as an $a^{**}‎$‎-module‎. ‎le...

in this paper, the notion of fully idempotent modules is defined and it is shown that this notion inherits most of the essential properties of the usual notion of von neumann's regular rings. furthermore, we introduce the dual notion of fully idempotent modules (that is, fully coidempotent modules) and investigate some properties of this class of modules.