Paper materials have a long history of use in packaging products, although traditional paper-based packaging is limited in its shape and design. In order to enable more advanced paper-based packaging, various 3-D forming processes for paper materials have been studied. Since 3-D forming processes typically include the application of moisture and/or temperature, the effects of moisture and tempe...

Increasing demand for new and more advanced electronic products with a smaller form factor, superior functionality and performance with a lower overall cost has driven semiconductor industry to develop more innovative and emerging advanced packaging technologies. One of the hottest topics in the semiconductor industry today is a 3D packaging using Through Silicon Via (TSV) technology. Driven by...

The food packaging sector generates large volumes of plastic waste due to the high demand for packaged products with a short shelf-life. Biopolymers such as starch-based materials are promising alternative non-renewable resins, offering sustainable and environmentally friendly single-use products. This article provides chronology development packaging. Particular emphasis is placed on challenge...