نتایج جستجو برای: packaging under vacuum

تعداد نتایج: 1108375  

Journal: :Jurnal Teknologi Pangan dan Gizi 2022

This an comparative experimental study that compares the quality of pindang cob packed with vacuum and non-vacuum at shelf life 0, 2, 7, 14, 28 days room temperature (30-33oC). The processing fishery products plays important role in post-harvest activities considering are perishable goods. Vacuum packaging technique is currently a popular among public. purpose this was to determine effect techn...

2017
Meng Jiang Wang Tao Yanbin Chen

Laser welding has been widely used in various industry fields. In order to further alter and broaden its applicability, a novel technology of laser welding under vacuum is introduced. The combination of high power laser and low ambient pressure provides an excellent welding performance and quality. In this paper, an overview on laser welding under vacuum is presented. It begins with a short int...

شکوهی, رضا, یزدانی, لیلی,

Expansion of one dimensional collisionless plasma into vacuum is studied under different initial ions temperature. In this study, a simulation code is used, in which the electrons dynamic is determined by Vlasov equation and the ions dynamic is determined  by fluids equations. Finally, the effect of initial ions temperature on the expansion of plasma into vacuum is investigated and the obtained...

Journal: :Acta scientiarum polonorum. Technologia alimentaria 2017
Reza Ahmadkhaniha Noushin Rastkari

BACKGROUND The safe use of recycled paper and cardboard material for food packaging applications is     an important area of investigation. Therefore, the aim of this study was to determine which hazardous chemi- cal pollutants were found in paper and cardboard samples used for pastry packaging, and to measure the migration of pollutants over time into the pastries. METHODS In this study, the...

2011
Li Jiang

This study mainly evaluated the thermo-mechanical reliability of lead-free packaging techniques for attaching large-area chip. With 3 MPa pressure, a low-temperature (<300 o C) sintering technique enabled by a nano-scale silver paste was developed for attaching 100 mm 2 silicon die. This new lead-free packaging technique for die-attachment was compared with soldering by vacuum reflow. Lead-free...

2013
Fabrizio Vecchio Conor Slater Thomas Maeder Peter Ryser

This paper presents the thermal characterization of an LTCC module dedicated for the packaging of a miniature atomic clock. An LTCC device of dimensions of 15 × 22 mm has been designed for the packaging of the elements of a miniature atomic clock. This module acts as a carrier for the components of the clock as well as temperature controller; this is particularly attractive since each component...

2001
Srinivas Tadigadapa Nader Najafi

Reliability is a key parameter for the eventual prevalence of microelectromechanical systems (MEMS) as either sub-components or as standalone products. Traditionally, micromachined components have been made by separating the micromachined chip design and fabrication processes from the packaging and reliability issues. This “evolutionary” partitioning of microsystems has led to long incubation t...

Journal: :Poultry science 2014
M B R Rodriguez C A Conte Junior C S Carneiro R M Franco S B Mano

The objective of the present study was to determine the shelf life of ready-to-eat cooked chicken breast fillets (shredded) stored in atmospheres that were modified with different concentrations of CO2 and to establish a relationship between the concentration of this gas and bacterial growth. The samples were divided into 7 groups with different packaging conditions: aerobiosis, vacuum, and 10,...

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