A new test system for measuring electric field profile in planar circuits such as microstrip-line has been developed. In order to estimate the measured electric field profile, the 3D full-wave analysis is carried out by using a finite-difference time domain technique for planar printed circuits in high-frequency ranges. A test system proposed in this paper based on a small coaxial probe antenna...

Introduction Radiofrequency planar microcoils are used to increase the resolution of magnetic resonance images of small samples. In this study, we aimed to design and fabricate a spiral planar microcoil constructed on a double-sided printed circuit board (PCB). It has four rings with an internal diameter of 241 microns tuned and matched at 63.8 MHz. Materials and Methods To achieve the maximum ...

This paper proposes a microstrip patch antenna for 2.45 GHz Industrial Scientific Medical (ISM) band Wireless Body Area Network (WBAN) applications. To enhance the front-to-back ratio (F/B) and specific absorption rate (SAR), an electrically coupled LC resonator is introduced. The overall dimensions of the proposed antenna are 54 mm × 45 mm × 2.4 mm and it has a gain of over 1 dBi for the entir...

---This paper proposes a technique which improves Directivity and control of Beam-Steering by including metamaterial surfaces onto microstrip patch antenna superstrate used for wireless communication applications. Metamaterials are designed with Artificial Magnetic Conductor (AMC), inductive and capacitive planar structures. These structures allow obtaining Partially Reflective Surfaces (PRS). ...

In this article, a time-domain test on the negative group delay behavior of double-Li-structure microstrip circuit is proposed. The feasibility validated experimentally using Gaussian envelopes modulating sine carrier frequencies inside and outside frequency bands.

A broadband left-handed parallel-line microstrip coupler is implemented by both electromagnetic simulation and actual fabrication. The circuit dimensions are smaller and more compact than those in previous studies and a thinner Duroid substrate of thickness h 0.635 mm is used. Parametric studies were performed using IE3D, and fabrication was done via a Quick Circuit 7000 prototyping machine. Th...

Simple broadband microwave interconnects are needed for increasing the size of focal plane heterodyne radiometer arrays. We have measured loss and crosstalk for arrays of microstrip transmission lines in flex circuit technology at 297 and 77 K, finding good performance to at least 20 GHz. The dielectric constant of Kapton substrates changes very little from 297 to 77 K, and the electrical loss ...