Thermo-mechanical behavior of the lead (Pb)-free ceramic copper column grid array (CuCGA) package under accelerated thermal cycling is characterized and compared with the conventional tin–lead (Sn–Pb) ceramic column grid array (CCGA). In situ thermal deformations of the highest DNP (distance to neutral point) copper column is measured for an initial isothermal loading of DT = 75 C and subsequen...

Potential problems induced by the multilayered manufacturing process pose a serious threat to the long-term reliability of MEMSCAP® actuators under in-service thermal cycling. Damage would initiate and propagate in different material layers because of a large mismatch of their thermal expansions. In this research, residual stresses and variations of design parameters induced by metal multi-user...

Nucleic acid-based diagnostic techniques such as polymerase chain reaction (PCR) are used extensively in medical diagnostics due to their high sensitivity, specificity and quantification capability. In settings with limited infrastructure and unreliable electricity, however, access to such devices is often limited due to the highly specialized and energy-intensive nature of the thermal cycling ...

We demonstrate a novel chemical cycling polymerase chain reaction (ccPCR) technique for DNA amplification in a fully working device where temperature is held constant in space and time. We demonstrate successful ccPCR amplification while simultaneously focusing products via isotachophoresis (ITP) for identification of the environmental bacteria E. Coli. We electrophoretically drive the DNA samp...

Ceramic thermal barrier coatings are commonly used in gas turbine hot components (e.g., combustor liners/buckets and guide vane platforms). In components that are only partially coated or have cooling-air outlets, coating-end stress singularities may lead to the spallation of the coating. Depending on the geometry of the transition from coated to uncoated material, the severity of the stress si...

Standard packaging and interconnection technologies of power devices have difficulties meeting the increasing thermal demands of new application fields of power electronics devices. Main restrictions are the decreasing reliability of bond-wires and solder layers with increasing junction temperature. In the last few years intensive efforts have been invested in developing new packaging and inter...

The effect of different distributions of y-phase precipitates on the martensitic transformation of p Cu-Zn-A1 single crystals is reviewed. The changes of transformation temperatures brought about by the precipitates are related to the changes of the free energy terms included in the thermoelastic balance. In the same way, the evolution of the transformation in samples containing precipitates su...