: We present molecular dynamics simulation of phonon thermal conductivity of semiconductor nanoribbons with an account for phonon quantum statistics. In our semiquantum molecular dynamics simulation, dynamics of the system is described with the use of classical Newtonian equations of motion where the effect of phonon quantum statistics is introduced through random Langevin-like forces with a sp...

The calculation of airflows is of great importance for detailed building thermal simulation computer codes, these airflows most frequently constituting an important thermal coupling between the building and the outside on one hand, and the different thermal zones on the other. The driving effects of air movement, which are the wind and the thermal buoyancy, are briefly outlined and we look clos...

Data center thermal management has become increasingly important because of massive computational demand in information technology. To advance the understanding of the thermal environment in a data center, complex computer models are extensively used to simulate temperature distribution maps. However, due to management policies and time constraints, it is not practical to execute such models in...

Like many other additive manufacturing processes, FDM process is driven by a moving heat source, and temperature history plays an important role in determining the mechanical properties and geometry of the final parts. Thermal simulation of FDM is challenging due to geometric complexity of manufacturing process and inherent computational complexity which requires numerical solution at every tim...

The thermal conductivity of molten sodium chloride and potassium chloride has been computed through equilibrium molecular dynamics Green-Kubo simulations in the microcanonical ensemble (N,V,E). In order to access the temperature dependence of the thermal conductivity coefficient of these materials, the simulations were performed at five different state points. The form of the microscopic energy...

Accurate simulation of transient device thermal behavior is essential to predict CMOS VLSI circuit failures under electrical overstress (EOS). In this paper, we present an eÆcient transient electrothermal simulator that is built upon a SPICE-like engine. The transient device temperature is estimated by the convolution of the device power dissipation and its thermal impulse response which can be...

Representative results of computer simulation and/or modeling studies of the nanomechanical and thermal transport properties of an individual carbon nanotube, silicon nanowire, and silicon carbide nanowire systems have been reviewed and compared with available experimental observations. The investigated nanomechanical properties include different elastic moduli of carbon nanotubes, silicon nano...

With a fast rising productivity and even faster rising integration densities, i.e., designproductivity-gap, energy and power dissipation are critical topics in high level system design more than ever. Thermal aware system design, reliable power delivery, and the overall energy dissipation are only few crucial design properties. In this work we present a framework based on SystemC, enabling the ...

Thermally induced displacements due to thermal expansions continue to present one of the main problem areas in the machine tool sector. To compensate displacements simplified thermal FE simulation models are developed, with which compensating calculations will be carried out online in the NC control computer in future (software in the loop). To increase the accuracy experimental tests are condu...

Hot stamping process is a high non-linear process showing the effect on thermal, mechanical and metallurgical phenomena as they relate to each other. In order to carry out this coupled numerical simulation, fundamental thermal properties such as interfacial heat transfer coefficient and convection heat transfer coefficient as well as crucial mechanics properties were first investigated. Hot sta...