We consider the deposition of a film of viscous liquid on a flat plate being withdrawn from a bath, experimentally and theoretically. For any plate speed U, there is a range of "thick" film solutions whose thickness scales like U{1/2} for small U. These solutions are realized for a partially wetting liquid, while for a perfectly wetting liquid the classical Landau-Levich-Derjaguin film is obser...

⎯ This paper compares two thick-film actuation technologies and assesses their suitability for use within micromachined devices. The materials are a piezoelectric composition, which exhibits a d33 coefficient of the order of 130pC/N, and a magnetostrictive material which possess a magnetostriction of 4.4ppm at a magnetic field of 11.5kA/m. Examples of their application in micromachined devices ...

Major part of this work was carried out in Hsinchu. ABSTRACT Mask-making process using laser direct-write has been broadly applied in the microelectronics and the PC board industries. In this paper, we report the thick-film lithography of laser write mainly for the x-ray mask in the LIGA application. Several schemes of multiple writing are successfully demonstrated in terms of the sidewall stra...

PRODUCT DESCRIPTION The AD592 is a two terminal monolithic integrated circuit temperature transducer that provides an output current proportional to absolute temperature. For a wide range of supply voltages the transducer acts as a high impedance temperature dependent current source of 1 μA/K. Improved design and laser wafer trimming of the IC’s thin film resistors allows the AD592 to achieve a...

A simulation program is developed which is capable of calculating the output responses of piezoresistive pressure sensors as a function of pressure and temperature. Analytical models based on small and large deflection theories have been applied to predict the sensitivity and linearity of pressure sensors. Surfacemicromachined diaphragms with square or circular shapes, fabricated by a low press...

This paper reports on polysilicon piezo-resistors that are fabricated at a low thermal budget using aluminium-induced-crystallization (AIC) of ultra-high-vacuum e-beam evaporated silicon films. By in-situ phosphorus doping of precursor amorphous silicon films e-beam evaporated at room temperature on aluminium layer, we are able to increase and control the gauge factor of the polysilicon films f...

Passive components for use in planar Monolithic Microwave Integrated Circuits (MMICs) based on High Electron Mobility Transistors (HEMTs) on indium phosphide substrates are presented. Design, fabrication, and modeling issues of capacitors, resistors, inductors, transmission lines, via holes, and air bridges have been addressed. Sputtered thin films have been utilized to make metal-insulator-met...

The spin coating of thin (> 200 nm thick) and ultrathin (< 200 nm thick) polymer films is examined in several solvents of varying volatility over a broad range of polymer solution concentrations and spin speeds. Experimentally measured film thicknesses are compared with a simple model proposed by Bornside, Macosko, and Scriven, which predicts film thickness based on the initial properties of th...

Titanium oxide (TiO2) films and TiO2/SiNx stacks have potential in surface passivation, anti-reflection coatings and carrier-selective contact layers for crystalline Si solar cells. A Si wafer, deposited with 8-nm-thick TiO2 film by atomic layer deposition, has a surface recombination velocity as low as 14.93 cm/s at the injection level of 1.0 × 1015 cm−3. However, the performance of silicon su...

A method has been developed allowing fabrication of electronic boards from flexible polymer film by ultrasonic embossing and welding within seconds. A commercially available ultrasonic welding machine and micro patterned tools from aluminum are employed first to generate conductor paths on a flexible polymer film, in a further step, surface mounted devices (SMDs) are assembled and fixed on the ...