A novel wet cleaning formulation approach was developed with a TiN etch rate of more than 30 Å/min at room temperature and more than 100 Å/min at 50oC. The chemicals are compatible with Cu and low-k materials, and are suitable for Cu dual damascene interconnect 28 nm and smaller technology node applications. The chemicals offer a route to in situ controlled TiN pullback or even complete removal...

M icbial Trsform aion of O rgnotin C om punds uder im uated Ldfill C onitions Liöping 2007 The cycling of tin is a topic of concern because of its anthropogenic entry of organotin compounds into the environment. Special attention is given to the transformation of organotins and the methylation of inorganic tin, since these processes often give rise to more toxic formulations. By far the largest...

The finite-temperature behavior of small silicon and tin clusters Si10, Si15, Si20, Sn10, and Sn20 is studied using isokinetic Born-Oppenheimer molecular dynamics. We find that the low-lying structures for all the clusters are built upon a highly stable tricapped trigonal prism unit which is seen to play a crucial role in the finite-temperature behavior. The thermodynamics of small tin clusters...

Motivation The increasing amount of peer-reviewed manuscripts requires the development of specific mining tools to facilitate the visual exploration of evidence linking diseases and proteins. Results We developed TIN-X, the Target Importance and Novelty eXplorer, to visualize the association between proteins and diseases, based on text mining data processed from scientific literature. In the ...

We performed in situ indentation in a transmission electron microscope on Al-TiN multilayers with individual layer thicknesses of 50 nm, 5 nm and 2.7 nm to explore the effect of length scales on the plastic co-deformability of a metal and a ceramic. At 50 nm, plasticity was confined to the Al layers with easy initiation of cracks in the TiN layers. At 5 nm and below, cracking in TiN was suppres...

An insulator-metal-insulator plasmonic interconnect using TiN, a CMOS-compatible material, is proposed and investigated experimentally at the telecommunication wavelength of 1.55 µm. The TiN waveguide was shown to obtain propagation losses less than 0.8 dB/mm with a mode size of 9.8 µm on sapphire, which agree well with theoretical predictions. A theoretical analysis of a solid-state structure ...

Extending the current “2.5D” terrain model is a necessary development in GIS. Existing 2D surface information must be extended to 3D, while trying to preserve the topological integrity. Computer-Aided Design (CAD) on the other hand is often fully 3D, which may be excessive for our “extended 2D” mapping needs. We have used the “boundary representation” (brep) design from CAD systems, based on ma...

Digital elevation models can represent many types of geographic data. One of the common digital elevation models is the triangulated irregular network (also called TIN, or polyhedral terrain, or triangulated terrain). We discuss ways to represent a TIN in a data structure, and give some of the basic algorithms that work on TINs. These include retrieving contour lines, computing perspective view...

Recently, a hardness similar to that of diamond has been reported for a quasiternary, nitride-based nanocomposite. The related, quasibinary nanocomposite "nc-TiN/a-Si3N4," which may be regarded as the prototype of the family of superhard nc-metal-N/a-Si3N4 systems, also exhibits a significant hardness enhancement. Extensive density-functional theory calculations indicate that the superhardness ...

The title compounds, [Sn3(CH3)9(OH)2(H2O)2][Sn(CH3)3(CHO2)2] (1) and [Sn3(CH3)9(OH)2]Cl·H2O (2), are partially condensed products of hydrolysed tri-methyl-tin chloride. In the structures of 1 and 2, short cationic tris-tannatoxanes (C9H29O2Sn3) are bridged by a diformatotri-methyl-tin anion or a chloride anion, respectively. Hydrogen bridges are present and supposedly stabilize these structures...