This paper describes the new framework of context-dependent (CD) Initial/Final (IF) acoustic modeling using the decision tree based state tying for continuous Chinese speech recognition. The Extended Initial/Final (XIF) set is chosen as the basic speech recognition unit (SRU) set according to the Chinese language characteristics, which outperforms the standard IF set. An adaptive mixture increa...

Objective: The aim of this study was to evaluate the Knoop hardness number (KHN) of methacrylate (MC) and silorane (SC) composites after being submitted to erosion and abrasion processes. Material and methods: Forty samples were made with each composite: MC and SC. The samples were divided into eight groups (n = 10) according to the type of composite (G1-G4, MC; G5-G8, SC) and the beverages inv...

Electromigration (EM) is one of the main reliability concerns in copper interconnects. In particular, it is a critical issue for new emerging technologies, such as through silicon via (TSV) technology. In this work the impact of formation and growth of voids under a TSV located at the cathode end of a typical dual-damascene line is analyzed. The resistance change of the structure is numerically...

Recombination-deficient (rec), radiation-sensitive mutations in Bacillus subtilis are grouped in at least seven distinct loci. Map positions are determined for six of these loci.

This paper presents a novel method of formant tracking. It shows that formant information can be extracted from the cepstrum coefficients . Explicit nonlinear formulas has been developed to map psd (power spectral density) of speech signal to formant frequencies. Formants can be tracked by ESPRIT (Estimation of Signal Parameters via Rotational Invariance Techniques). An ”‘constrained”’ ESPRIT s...

With the leakage-thermal dependency, the increasing on-chip temperature in 3D designs has serious impact on IR drop due to the increased wire resistance and increased leakage current. Therefore, it is necessary to consider Power/Ground network design with thermal effects in 3D designs. Though Power/ Ground (P/G) TSV can help to relieve the IR drop violation by vertically connecting on-chip P/G ...

For modern VLSI/ULSI fabrication the use of multilevel interconnects is of crucial importance. For electromigration reliability characterizations, time-consuming stress measurements have to be carried out [1,2]. During these measurements a via-hole chain is stressed because of high temperature and high current densities, and the resistance is determined. This type of measurement usually takes m...