Acting as the bridge between the designers and manufacturing companies, Chip Implementation Center (CIC), founded in 1992 under National Science Council, aims at the services for the fabrication of multi-project chip, the procurement / integration of software CAD tools, and the promotion of IC design / testing / CAD software technology. To date, 2000 academic licenses of software CAD tools have...

Timed asynchronous circuits can be implemented using commercial computer-aided design (CAD) tools. Relative timing methodology is applied for interpreting the complex timing of asynchronous circuits into CAD tools that can be understood with minimum and maximum timing constraints. Typical synchronous placement algorithm neglect timing information which is critical for asynchronous methodology. ...

A CAD (computer aided design) analysis software package (CADVIEW) was designed for use with prosthetic and orthotic CAD CAM (computer aided design/computer aided manufacture) systems. Using the Microsoft Windows 3.1 environment, CADVIEW provides a series of anatomical shape viewing and analysis tools. These tools include simultaneous display of multiple sockets and multiple views, two dimension...

In this paper, a neutral file format—STEP (Standard for the Exchange of Product model data) is used to transfer geometrical data from CAD tools to assembly analysis tools. JSDAI (Standard Data Access Interface for STEP binding to JAVA) is used to read geometrical data from the CAD STEP files. After all necessary geometrical data is extracted from the CAD STEP files, the interference relationshi...

Integrating analytic tools within a production Computer Aided Design (CAD) environment provides designers the opportunity to evaluate the impact of design decisions much earlier in the design process than previously possible. Softdesk Energy is a design tool that integrates building energy analysis capabilities into a highly automated production drafting environment (AutoCAD and Softdesk AutoAr...

The higher speed requirement and rising complexity of interconnect and packaging structure in a VLSI system have increased the necessity of applying modeling and simulation techniques to develop CAD tools for analysis and design. To effectively manage design data and CAD tools involved for modeling and simulation of electronic packaging, a framework which provides different levels of services a...

Three-dimensional integrated circuits (3D-ICs), which contain multiple layers of active devices, have the potential to dramatically enhance chip performance, functionality, and device packing density. They also provide for microchip architecture and may facilitate the integration of heterogeneous materials, devices, and signals and offer a promising solution for reducing both silicon footprint ...