The microstructure of sputter deposited Ti-rich Ni-Ti thin films doped with Cu in the range 020.4 at.% and annealed for 1 h at 500 and 600°C has been investigated and correlated with the mechanical properties of the films measured by depth-sensing nanoindentation. X-ray diffraction analysis showed the microstructural evolution of Ni-Ti thin films when doped with Cu and annealed at different tem...

the concentration of cu, mn, ni and zn were determined in tomatoes and onions samples using atomic absorption spectrometry. a total of 32 samples each of tomatoes and onions were collected from the exposed and control sites for analysis. the trace metals (cu, mn, ni and zn) concentration in tomatoes wee found to be 6.2406, 6.5521 , 5.7375 and 8.9297 mg/kg-1, respectively. while those of onions ...

This study addresses the feasibility of removing Cu and Ni from sludges of printed circuit board (PCB) plants by acidic extraction. Citric acid, acetic acid, hydrochloric acid, nitric acid, and sulfuric acid at various concentrations were experimentally examined to determine preferred conditions for removing Cu and Ni. Experimental results indicate that the removal ratios of Cu were 57% (citric...

A study was carried out to characterize Ni-Co-PVC and Ni-Cu-PVC composite materials prepared by mechanical alloying technique (MAT) using SEM, EDS and electrochemical test. Composite materials were prepared by mixing together 95% of metal powder (Ni+Co or Ni+Cu) with 5% PVC. PVC was used as a binder and tetrahydrofuran (THF) was used as a solvent in composite material preparation. Based on the ...

Ni-implantation has been conducted for sputter deposited Zr alloy films to investigate compositional dependent amorphization behavior in proportion to Ni in Zr alloys. As-deposited Zr and Zr–Cu with thickness of 200 nm shows columnar hcp-Zr and nano-crystalline hcp-Zr(Cu), respectively. Implantation of 150 keV Niþ with the amount of 1 10 ions/cm induces amorphization of Zr and Zr(Cu) with 100 n...

The kinetics of the solid-state reactive diffusion between Sn­Ni alloys and pure Cu was experimentally observed to examine effects of addition of Ni into Sn on the growth behavior of compounds at the interconnection between the Sn-base solder and the multilayer Au/Ni/Cu conductor during energization heating. In this experiment, sandwich (Sn­Ni)/Cu/(Sn­Ni) diffusion couples with Ni concentration...

We find that the photoelectron angular distributions from the Fermi surface of a monolayer Ni film on Cu are identical to those from thick Ni films and single-crystal Ni(001), and agree well with theoretical predictions for bulk Ni. This bulklike behavior in the monolayer film is attributed to the short screening length of electrons in metals, the similarity of the Ni and Cu cores, and a hybrid...

The effect of under-bump-metallization (UBM) on electromigration was investigated at temperatures ranging from 135C to 165C. The UBM structures were examined: 5-μm-Cu/3-μm-Ni and 5 μm Cu. Experimental results show that the solder joint with the Cu/Ni UBM has a longer electromigration lifetime than the solder joint with the Cu UBM. Three important parameters were analyzed to explain the differen...