نتایج جستجو برای: diamond wire saw

تعداد نتایج: 68949  

Journal: :Silicon 2021

In this paper, the acceleration effect of nickel (Ni) on direct nitridation process diamond-wire saw powder (DWSP) was investigated. The DWSP doped with Ni additives were nitrided at different temperatures. To study mechanism accelerated nitridation, thermodynamics Si-O-N-Ni and processes analyzed by FactSage 7.2 single-crystal silicon blocks also instead DWSP. results revealed that decreased t...

Journal: :The International Journal of Advanced Manufacturing Technology 2021

Abstract Today, wire sawing of natural stone is undergoing widespread commercialization. In addition to rock extraction and processing with single wires, composed a multitude diamond-impregnated beads mounted onto steel rope, this technology increasingly used for slabbing granite blocks on multi-wire machines. Evolving sophistication equipment dictates novel tool designs formulations. For techn...

2009
Michael Wieczorek Xianrong Huang Jozef Maj Ray Conley Jun Qian Albert Macrander Cynthia Christensen John Hodsden Ruben Khachatryan

The next generation of X-ray diffraction optics will benefit from crystal surfaces with very high quality (extremely flat and strain-free), but knowledge on how to achieve such surfaces, and how surface imperfections affect the diffraction properties, is sparse in the literature. As a first step toward initializing a systematic study on this topic, we evaluate in this paper the surface quality ...

1999
I. Kao V. Prasad J. Li M. Bhagavat

Wire saw, with its ability to cut very thin wafers from large diameter crystalline ingots of semiconductor materials, has emerged as a leading technology for wafer production in semiconductor and photovoltaic industry. Nevertheless, the wire saw cutting process remains lacking a theoretical methodology and is not properly understood. The modern times compulsion of more accurate and efficient ma...

2017
Sindy Würzner Martin Herms Thomas Kaden Hans Joachim Möller Matthias Wagner

A detailed approach to evaluate the sub-surface damage of diamond wire-sawn monocrystalline silicon wafers relating to the sawing process is presented. Residual stresses, the presence of amorphous silicon and microcracks are considered and related to diamond wire velocity and cutting ability. In particular, the degree of amorphization of the wafer surface is analyzed, as it may affect the etchi...

Journal: :International Journal of the Society of Materials Engineering for Resources 2014

Journal: :The Journal of bone and joint surgery. British volume 2002
M Piska L Yang M Reed M Saleh

An innovative Kirschner (K-) wire point was developed and compared in fresh pig femora in terms of drilling efficiency and temperature elevation with the trochar and diamond points currently used in clinical practice. The tips of thermal couples were machined to the defined geometry and the temperature measured during drilling. Using the same drill speed (rev/min) and feed rate, the new K-wire ...

2017
J. C. Gerbedoen A. Taylor A. Talbi A. Soltani M. Kempa P. Cígler

This study focuses on the fabrication and characterization of Love wave surface acoustic wave (LW-SAW) sensors with a thin nano-crystalline diamond (NCD) coating with an integrated microfluidics system. The effect of diamond layer thickness on the acoustic wave phase velocity and the sensor’s sensitivity have been investigated experimentally and compared with theoretical simulations. The fabric...

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