In this study, interfacial reactions of electrolytic Ni and electroless Ni(P) metallization of the ball-grid-array (BGA) substrate with the molten n–9Zn (wt.%) eutectic solder alloy were investigated, focusing on the shear strengths and the identification of the intermetallic compound IMC) phases at various reflow periods. Zn-containing Pb-free solder alloys were kept in molten condition (240 ◦...

t is well recognized that electroless I.' nickel-phosphorus offers excellent deposition characteristics, such as uniform coverage, freedom from porosity, hardness, corrosion resistance, solderability, braze and weldability, wear resistance and lubricity.' Interest in the properties of electroless nickel has grown in recent years, leading to the development of wide-ranging applications, a compre...

In the previous chapter, the components of electroless nickel plating baths were discussed from the viewpoint of the function each performs in the bath, with little attention paid to their effect on the plating process. The metal and the electron source (the reducing agent) are consumed in the electroless plating reaction and so their concentrations in the bath are continuously decreasing. Ther...

Flip Chip (FC) Technology is gaining an increased level of importance for a variety of applications based on Flip Chip on Board or Flip Chip in Package. The first driving force for the introduction of this Technology was the need to achieve increased speed and performance along with higher I/O count. A breakthrough, however, will be the use of flip chip due to cost reduction. For this aim it is...

This review outlines the development of electroless Ni–P composite coatings. It highlights the method of formation, mechanism of particle incorporation, factors influencing particle incorporation, effect of particle incorporation on the structure, hardness, friction, wear and abrasion resistance, corrosion resistance, high temperature oxidation resistance of electroless Ni–P composite coatings ...

Cu-filled TSV (through silicon via) is important technology for 3-D LSIs in order to obtain higher packing density, faster signal transmission, and lower power consumption. Diameter of TSV is expected to be smaller than 2 μm, and its aspect ratio to be larger than 10 in near future [1]. For realizing a high aspect ratio Cu-filled TSV, it is essentially important to form the barrier and seed lay...

ELECTROLESS DEPOSITION OF SUPERCONDUCTING MAGNESIUM DIBORIDETHIN FILMS ON VARIOUS SUBSTRATES

this paper focused on a novel method of electroless plating ruthenium (ru) on solid or porous substrates like porous stainless steel (pss) discs or ceramic tubes. a novel complexing plating bath of ru was developed. it is proven that ru can be deposited directly on these substrates by the bath at a temperature of 328 k and strong alkaline environment. tga, sem, edx and xrd confirmed the success...

By simply supporting carbon nanotubes with a metal substrate of a redox potential lower than that of the metal ions to be reduced into nanoparticles, we have developed a facile yet versatile and effective substrate-enhanced electroless deposition (SEED) method for functionalizing nanotubes with a large variety of metal nanoparticles, including those otherwise impossible by more conventional ele...

The importance of microscopic morphological control to metal electroand electroless deposition in several emerging technologies is discussed. The use of in situ optical probes of the morphological development of deposits is described. A number of these are reviewed to describe both the potential of each method and the available literature on studies of electroand electroless deposition. Include...