Electroless nickel plating baths have to be discarded when levels of phosphites build up and interfere with the plating process. OWMC funded research conducted at ORTECH International to determine whether phosphites could be removed from plating bath solution. The first attempt to do this by adsorption on flyash was unsuccessful. However, the use of calcium ion to precipitate calcium phosphite ...

In this paper, bath control is proposed for the electroless nickel plating through holes board process. The main parameters of the product (board) – thickness of the plating film and phosphorous content – are stabilized at constant levels using optimal tracking control. The set point for control is calculated from the model in dependence on the current state of the process. The pH-index and nic...

long-term use of indwelling medical catheters has often been hindered by catheter-associated nosocomial infections. in this study the effectiveness of silver coating of polystyrene and polyethylene polymers was investigated. polymer pieces of 2 cm2 each were coated with a thin layer of silver using electroless plating technique. silver-coated polymers were challenged with cultures of four diffe...

Very often electroless electrolytes contribute to wastewater treatment problems. These electrolytes are used in electroless plating processes, which contain a variety of chemicals to meet special surface treatment requirements. Metal salts produce the base material for metal deposition and hypophosphite is delivering the electrons for the metal reduction process – it is basically the internal e...

We present an original two-step method for the deposition via precipitation of Pd nanoparticles into macroporous silicon. The method consists in immersing a macroporous silicon sample in a PdCl2/DMSO solution and then in annealing the sample at a high temperature. The impact of composition and concentration of the solution and annealing time on the nanoparticle characteristics is investigated. ...

As the laminate substrate industry moves from Hot Air Solder Level (HASL) finishes, alternate plating finishes are being proposed such as immersion gold/electroless nickel, electroless palladium and electroless silver. This paper presents results of an evaluation of the thermosonic gold ball wire bondability of electroless palladium. Two palladium thicknesses, with and without a nickel underlay...

The formation of Au microbump arrays for flip-chip bonding was investigated using an electroless Au plating bath. Generally, electroless Au deposition gives a low deposition rate, preventing the fabrication of Au bumps with heights of more than 5 μm. To overcome this problem, we developed a new electroless Au deposition process that employs a non-cyanide bath. This process delivers a high depos...

Cu-filled TSV (through silicon via) is important technology for 3-D LSIs in order to obtain higher packing density, faster signal transmission, and lower power consumption. Diameter of TSV is expected to be smaller than 2 μm, and its aspect ratio to be larger than 10 in near future [1]. For realizing a high aspect ratio Cu-filled TSV, it is essentially important to form the barrier and seed lay...