The influence of cathode agitation on the residual stress of electroplated gold has been investigated. Using a custom-built plating cell, a periodic, reciprocating motion was applied to silicon substrates that were electroplated with soft gold. A commercially available gold sulfite solution was used to deposit the 0.6 lm thick gold films using a current density of 3.0 mA/cm and a bath temperatu...

This paper reports on a study of the reaction of solder with the electrolessnickel with immersion gold (ENIG) plating system, and the resulting interfacial structures. A focused-ion beam (FIB) was used to polish the cross sections to reveal details of the microstructure of the ENIGplated pad with and without soldering. High-speed pull testing of solder joints was performed to expose the pad sur...