We studied the solid-state reaction of Ni thin films with InGaAs layers grown on InP or Si substrates. The intermetallics obtained carried an hexagonal structure, but yielded a difference in orientation regarding either the substrates or the annealing temperature.

Using first-principles calculations, based on disordered local moment theory, combined with the selfinteraction corrected local spin density approximation, we study magnetic interactions in GdX intermetallics for X = Cu, Zn, Ga, Cd, and Mg. Our predicted magnetic orders and ordering temperatures both at zero and other pressures agree well with experiments including the large increase in the Cur...

The itinerant electron metamagnetism (IEM) is an essential physical concept, describing magnetic properties of rare earth - transition metal (R-TM) intermetallics, demonstrating technologically important giant magnetoresistance and magnetocaloric effects. It considers an appearance of TM magnetization induced by spontaneous magnetization of surrounding R atoms, which provides significant respon...

The outlook for improving the energy product of permanent magnets beyond the theoretical limit of 516kJ/m3 for Nd,Fe,,B is discussed. Most promising are nanostructured two-phase magnets consisting of an aligned hard-magnetic skeleton phase possessing exceptionally high uniaxial anisotropy and a soft-magnetic phase which assures a high magnetization. Brown’s paradox is discussed for inhomogeneou...

Fe3Al intermetallics (Fe3Al, Fe3Al-Zr, Fe3Al-Zr,Mo and Fe3Al-Zr, Mo, Nb) were oxidized at 950 °C in dry and humid (11 vol% water) synthetic air. Thermogravimetric measurements showed that the oxidation rates of the tested intermetallics were lower in humid air than in dry air (especially for Fe3Al-Zr, Mo and Fe3Al-Zr, Mo, Nb). The addition of small amounts of Zr, Mo or Nb improved the kinetics ...

Mo-Si-B intermetallics consisting of the phases Mo3Si and Mo5SiB2, and a molybdenum solid solution (“ -Mo”), have melting points on the order of 2000 °C. These alloys have potential as oxidationresistant ultra-high-temperature structural materials. They can be designed with microstructures containing either individual -Mo particles or a continuous -Mo phase. A compilation of existing data shows...

This work relates to wafer bumping technologies for flip chip packaging applications in the electronics industry. Nickel and its alloys are alternative under bump metallization (UBM) materials because of their slower reaction rates with Sn-based solder as compared to Cu-based UBMs. In this study, we compared the morphologies of the intermetallic compounds (IMC) formed between Sn-bearing solders...