نتایج جستجو برای: lead alloy
تعداد نتایج: 390493 فیلتر نتایج به سال:
A modified strain-induced melting activation (SIMA) process is shown to improve high-temperature formability. The microstructural characteristics of the spheroidized grains of SIMA-processed alloys affect high-temperature formability. The effects of hot extrusion parameters and chemical composition on the evolution of spheroidized grains were investigated using several 6xxx series aluminum allo...
Preparation of Soft Magnetic Fe-Ni-Pb-B Alloy Nanoparticles by Room Temperature Solid-Solid Reaction
The Fe-Ni-Pb-B alloy nanoparticles was prepared by a solid-solid chemical reaction of ferric trichloride, nickel chloride, lead acetate, and potassium borohydride powders at room temperature. The research results of the ICP and thermal analysis indicate that the resultants are composed of iron, nickel, lead, boron, and PVP, and the component of the alloy is connected with the mole ratio of pota...
The influence of alloy composition of lowmelting Sn-Bi-Cu lead-free solder alloys on mechanical properties and solder joint reliabilities were investigated. The mechanically optimum alloy composition is Sn-40Bi-0.1Cu (mass%). The addition of 40mass%Bi improves the ductility and restrains the fillet-lifting, which are problems of lead-free solders with Bi. The addition of copper improves both th...
The electrochemical and corrosion behavior of a stainless-steel-based alloy made as a prototype metallic nuclear wasteform to immobilize Tc, has been studied in a number of reference solutions ranging in pH from 4 to 10. The results showed the 47SS(304)-9Zr–23Mo prototype alloy contained at least five distinct phases with the majority of the Re, used as a Tc surrogate, contained within a Fe2Mo ...
As the electronics industry begins to focus upon the tin-silver-copper family of alloys as a viable replacement for tin-lead solders, research needs to be done to determine if any particular alloy is best suited for the broadest range of applications. The tin-silver-copper family of alloys has earned a great deal of positive response from various industry consortia and organizations in recent y...
An interfacial thermodynamic model predicts that the interplay of grain boundary (GB) premelting, prewetting, and retrograde solubility in a binary alloy can lead to a decrease in the GB diffusivity with increasing temperature. This counterintuitive prediction is experimentally confirmed for a single-phase, Mo +0.5 at. % Ni alloy. This study calls for a reappraisal of the classical GB adsorptio...
Control over the dimensions and shape of nanostructures represents one of the main challenges in modern materials science. Morphology control of a variety of materials can be achieved using vapor–liquid–solid or solution–liquid–solid techniques to obtain one-dimensional (1D) systems. The unique optical and electrical properties of 1D nanostructures make them one of most important building block...
Iron released by steel corrosion was found to be a key impurity in reactions with dissolved oxygen in liquid lead-bismuth eutectic alloys. The iron-oxygen-magnetite equilibrium was characterized, allowing the quantification of phenomena that are important for long-term operation of lead-alloy based installations such as corrosion rate control and management of precipitates.
Abstrak Shape Memory Alloy (SMA) adalah salah satu jenis aktuator yang sedang banyak dipelajari pada aplikasi skala mikro dan nano. Namun di sisi lain, pengembangan pengendalian dalam skala ini masih perlu pengembangan dan penelitian lebih lanjut. Artikel ini mempresentasikan hasil evaluasi tanggapan pergerakan kendali kalang tertutup dari TiNi SMA dalam bentuk spring yang dikendalikan kompensa...
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