Modal analysis is widely approached in the classic theory of power systems modelling. This technique is also applied to model multiconductor transmission lines and their self and mutual electrical parameters. However, this methodology has some particularities and inaccuracies for specific applications, which are not clearly described in the technical literature. This study provides a brief revi...

In this paper, the capacitance and inductance of a four-line transmission structure is characterized. The procedure used was developed by Ymeri et al for general analysis of multilayer multiconductor interconnects for specific applications in microelectronics. The characterization is based on the determination of the quasi-static electric scalar potential in the structure making up the four-lin...

An accurate and efficient modelling approach for field effect transistors (FET) as nonlinear active transmission lines is presented. The nonlinear active multiconductor transmission line (NAMTL) equations are obtained by considering the transistor as three active coupled lines operating in a nonlinear regime. This modelling procedure accurately spots the effect of wave propagation along the dev...

In this study an efficient approach is presented for the transient simulation of lossy, frequency-dependent multiconductor transmission lines. The method is based on the approximation of the modal scattering parameters of the system. Rational function approximation and recursive convolution are used to generate the time-domain stamps of the multiconductor system

The demand for computer simulation of multiconductor interconnections in VLSI structures necessitates that such structures should be modelled. Calculations of the model capacitance matrix from measurements, for the multiconductor transmission lines which are coupled interconnections in a VLSI structures, using the "two-terminal" capacitances indirect measurement procedure is strongly corrupted ...

This thesis examines the effects of electromagnetic interference (EMI) and coupling in circuits and systems. The coupling phenomenon is investigated in nonuniform transmission lines and adjacent via structures in microelectronic circuits. Radiation from metallic enclosures with apertures and lined with resistive materials is analyzed. Electromagnetic interference on a larger scale is studied in...

The microstrip line is widely used as the planar transmission line in microwave integrated circuits and high speed interconnecting buses. In this paper, we use COMSOL multiphysics to study multiconductor microstrip systems on microwave integrated circuits. We specifically illustrate the modeling of open four and five conductors systems. We successfully demonstrated the calculation of the capaci...

The silicon substrate has a significant effect on the inductance parameter of a lossy interconnect line on integrated circuit. It is essential to take this into account in determining the transmission line electrical parameters. In this paper, a new quasi-TEM capacitance and inductance analysis of multiconductor multilayer interconnects is successfully demonstrated using finite element method (...