نتایج جستجو برای: mutual inductance
تعداد نتایج: 45915 فیلتر نتایج به سال:
Abstract: In order to increase the power rating of electric vehicles, insulated gate bipolar translator (IGBT) modules with multiple power terminals are usually adopted. The transient current sharing of the same polarity power terminals is related to the stray inductance in the branches of the bus-bar. Based on the laminated bus-bar of a three-phase inverter in the electric vehicles that consis...
With operating frequencies entering the multi-gigahertz range, inductance has become an important consideration in the design and analysis of on-chip interconnects. In this paper, we present an accurate and efficient inductance modeling and analysis methodology for high-performance interconnect. We determine the critical elements for a PEEC based model by analyzing the current flow in the power...
In recent years, the popularity of wireless inductive power transfer (WIPT) system for electric vehicle battery charging (EVBC) is always ever-increasing. In the WIPT inductively coupled coil structure is the heart of the system and the mutual inductance (MI) between the coupled coils is the key factor for effective power transfer. This paper presents the analysis of mutual inductance between t...
In this paper a virtual mutual inductance approach is used to analyse the performance of transverse flux machines (TFMs). The virtual mutual inductance between the stator windings and the magnets’ equivalent currents is obtained by integrating the flux produced by the stator windings over the surface of the magnets. Key design parameters such as back EMF, torque, phase inductance and power fact...
In this paper, we propose a new exact closed form mutual inductance equation for on-chip interconnects. We express the mutual inductance between two parallel rectangular conductors as a weighted sum of self-inductances. We do not place any restrictions on the alignment of the two parallel rectangular conductors. Moreover, they could be co-planar or reside on different layers. Most important, de...
To make three-dimensional (3-D) on-chip interconnect inductance extraction tractable, it is necessary to ignore parasitic couplings without compromising critical properties of the interconnect system. It is demonstrated that simply discarding faraway mutual inductance couplings can lead to an unstable approximate inductance matrix. In this paper, we describe an equipotential shell methodology, ...
Inductance has been identified as an emerging troublemaker of interconnects for the next generation high-speed digital VLSI design. As a result, accurate and fast inductance extraction is of crucial importance. Formulae-based partial inductance extraction method approaches have been widely adopted for inductance extraction due to its simplicity and efficiency. However, there are so many inducta...
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