نتایج جستجو برای: pulse plating
تعداد نتایج: 99307 فیلتر نتایج به سال:
This study observes that copper (Cu) films deposited by high current densities or in an aged electrolyte easily generate void defects after chemical mechanical polishing (CMP). The (111)/(200) ratio and the impurity amount of an electroplated Cu film are found to have strong correlation with the formation of void defects. Furthermore, pulse-reverse waveform plating following direct current plat...
This paper presents systematic investigations on complete through hole filling for cores using a Cu electroplating process as an alternative to the common paste plugging process [1]. This technology is targeting at both HDI production and also at the packaging level [2]. This electro plating process consists of two steps, a first process to merge both centers of the through hole walls (X-platin...
In this study, using 45# carbon steel as the substrate, a first experimental analysis was carried out on polarisation behaviour of different component wattage plating solutions in order to determine reasonable content nanodiamond particles nickel/nanodiamond composite solution. Secondly, effect double-pulse forward and reverse duty cycle working time performance then investigated by testing thi...
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