In this study, infrared thermography is used to measure the temperature response of integrated on silicon spiral inductors to a unit step electrical signal used to excite the samples. The measurements are performed with the use of high speed infrared equipment. The thermal impedance is then extracted from the transient temperature response. Finally, an attempt is made to model the thermal netwo...

Multilevel spiral inductors are viable means to achieve enhanced inductance when designing in a multiple metallization level environment, as is typical of processes used for fabrication of RFICs. In this paper, analyses and design considerations are discussed for several spiral structures implemented in CMOS and BiCMOS technologies. Design issues considered include the performance effects of ge...

This paper describes three micromachined planar inductors (a spiral type, a solenoid type, and a toroidal meander type) with electroplated nickel–iron permalloy cores which have been realized on a silicon wafer using micromachining techniques. The electrical properties among the fabricated inductors are compared and the related fabrication issues are discussed, with emphasis on the low-temperat...

Integrated flexible parylene-based inductors were successfully designed, fabricated and analyzed. Using parylene as the substrate, the inductors have good flexibility and biocompatibility. With the Ni80Fe20 core, the inductance was enhanced by 235% maximally and the quality factor was also improved significantly. The square spiral inductor showed the inductance of 800nH at 55MHz. The coil coupl...

Spiral inductors fabricated in a 0.18μm 6-level Cu interconnect low-K dielectric process suspended 100μm above the substrate with sidewall oxide removed are described. A maskless post-CMOS micromachining process has been developed for the low-K dielectric copper interconnect process. Post-CMOS process enhancements of inductors provide higher quality factors and self-resonant frequencies by unde...

Symmetric spiral inductors are used for differential circuit applications for their robustness and superior noise rejection properties. In this work, characteristics of quality factor and inductance of symmetric inductors having octagonal structures, and the methods to improve performance have been suggested using the Agilent Momentum simulator [1]. From the results, we get differential quality...

This paper presents an efficient modeling method, based on the microstrip lines theory, for the coupling between a sub­strate backplane and a device contact. We derive simple closed-form formulas for rapid extraction of substrate parasitics. We use these formulas to model spiral inductors as important substrate-noise sources in mixed-signal systems. The proposed model is verified for the freque...