In this study, injection molding process of ultrahigh molecular weight polyethylene (UHMWPE) reinforced with nano-hydroxyapatite (nHA) was simulated and optimized through minimizing the shrinkage and warpage of the hip liners as an essential part of a hip prosthesis. Fractional factorial design (FFD) was applied to the design of the experiment, modeling, and optimizing the shrinkage and warpage...

Currently, the flip chip package is one of the standard semiconductor packages in the world market. Also, there are variety of materials and configurations used in flip chip packages with further high performance or miniaturization. From the encapsulate materials point of view, many types of assembly methods are presently studied on a current standard process as well as novel proposed processes...

It is certainly true that, in most instances, the best approach to take with a warped object is one of tolerance. Occasionally, however, one must treat objects which defy this conservative rationale. Sometimes the extent of warpage is so great that the appearance of an object is severely affected. Even worse, warpage may impede the function of an object, or may contribute to stresses which may ...

in this study, the effective factors on warpage in short fibre reinforced thermoplastic composites has been studied. first of all, the effective factors in manufacturing process were detected and then in order to decrease the number of experiments, the approach of design of experiments has been applied. by using micromechanics theory in composites and coefficients of thermal expansion models, a...

Wafer warpage is common in microelectronics processing. Warped wafers can affect device performance, reliability and linewidth control in various processing steps. We proposed in this paper an in-situ approach for estimating wafer warpage profile during the thermal processing steps in microlithography process. A programmable multizone thermal processing system is developed to demonstrate the ap...

The thermally induced warpage of electronic substrates is a significant concern in manufacturing processes. The ability to evaluate substrate behavior with respect to temperature is particularly important to manufacturing engineers. Previous measurement of thermally induced warpage on Printed Circuit Boards (PCBs) using general Shadow Moiré cannot provide enough sensitivity for modern electroni...

The shape memory effect, as the most important ability of polymers, is a working property and provides design to polymer features. Shrinkage warpage are parameters control dimensional accuracy permanent temporary shapes an injection moulded polyurethane (SMPU) part. In this study, effects moulding on shrinkage SMPU parts were experimentally investigated. pressure, melt temperature, mould packin...

Microelectronic science and technology is shrinking the world. Advanced packaging and systems make bulk electronic devices miniaturized and multi-functioned. In fact, mobile, wireless, and hand-held products are becoming the mainstream of personal, as well as business practice. This new trend makes warpage, one of the main assembly issues in electronic packaging, more critical to product yield ...

Computer simulation of injection moulding process is a powerful tool for optimisation moulded part geometry, mould design and processing parameters. One the most frequent faults parts their warpage, which result uneven cooling conditions in cavity as well after ejection from down to environmental temperature. With computer it possible predict potential areas warpage apply remedies compensate/mi...