statement of problem: bracket de-bonding during initial orthodontic archwire placement immediately after bracket set up or following re-bonding a single bracket can be a clinical concern. purpose: the aim of this in vitro study was to assess the effect of time on the shear bond strength of a no-mix orthodontic composite adhesive. materials and methods: seventy freshly extracted human upper firs...

PURPOSE There have been anecdotal reports of low bond strength with autocured resin composite materials, particularly when light-cured bonding agents that combine primer and adhesive in a 1-bottle preparation are used. The objective of this study was to determine if the mode of polymerization of the bonding agent influences the strength of the attachment of autocured resin composite luting ceme...

Early history of dentin bonding Attempts to develop an adhesive system which bonds acrylic resins to the tooth structure started in the early 1950s. In 1949, an adhesive system capable of bonding acrylic resin to the tooth structure was invented by Hagger; it was composed of glycerophosphoric acid dimethacrylate (GPDM) and sulfinic acid as the catalyst. In his patent, shear bond strengths of ac...

BACKGROUND The current surgical therapy of midfacial fractures involves internal fixation in which bone fragments are fixed in their anatomical positions with osteosynthesis plates and corresponding screws until bone healing is complete. This often causes new fractures to fragile bones while drilling pilot holes or trying to insert screws. The adhesive fixation of osteosynthesis plates using PM...

Introdouction: Esthetic demands of patients have led to the introduction of tooth-colored restorations wherecomposite resins are bonded to the enamel using acid etch techniques. Total etch adhesion systems are still considered as the gold standard among bonding systems. However, clinicians have a tendency to use adhesive systems with simpler application procedures. The aim of the present stu...

For microoptics and microsystem assembly, solder bumping is introduced as a flexible and high precise joining alternative to adhesive bonding, especially if adhesives limit the system performance in terms of long term, high temperature, vacuum or UV stability. The bumping technology, which is based on jetting the liquid solder onto wetting surfaces, can be parameter optimised to work in complex...

Matrix metalloproteinases (MMPs) have been studied extensively, and MMP inhibitors have been used as dental pretreatment agents prior to dentin bonding because they reduce collagen fiber degradation and improve bonding strength. However, morphologic characteristics of the collagen network after etching and of the post-adhesive dentin hybrid layers (DHL) after MMP inhibitors pretreatment have no...

Free-standing SU-8 chips with enclosed microchannels and high density of fluidic inlets have been made in a three-layer process which involves SU-8 to SU-8 adhesive bonding and sacrificial etching. With this process we can fabricate microchannels with depths ranging from 10 to 500 m, channel widths from 10 to 2000 m and lengths up to 6 cm. The process is optimized with respect to SU-8 glass tra...

This paper aims at making a study on the bonding properties of birch with API adhesive. A non-formaldehyde adhesive to improve the bonding strength and water resistance of the emulsion was investigated. The adhesive was a composite system that was formulated from polyvinyl acetate (PVAc) emulsion, PVA, isocyanate and some other additives. In this study the effect of isocyanate at room temperatu...