Reaction of RNHC(S)PPh2NPPh2C(S)NR (HRSNS; R = Me, Et) with M(I) (M = Cu, Ag, Au) salts afforded zwitterionic complexes of the general formula [M(RSNS)] (M = Cu, Ag, Au). The ligand was found in the solid state in S,S-kappa2 and S,N,S-kappa3 coordination fashions. [Cu(RSNS)] and [Ag(RSNS)] can be used as metalloligand building blocks for the assembly of pentanuclear multizwitterionic Cu5, Cu3Ag...

A binary embedded-atom method (EAM) potential is optimized for Cu on Ag(111) by fitting to ab initio data. The fitting database consists of DFT calculations of Cu monomers and dimers on Ag(111), specifically their relative energies, adatom heights, and dimer separations. We start from the Mishin Cu–Ag EAM potential and first modify the Cu–Ag pair potential to match the FCC/HCP site energy diffe...

Iranian Cenozoic magmatic belt, known as Urumieh-Dokhtar, is recognized as an important polymetallic mineralization which hosts porphyry, epithermal, and polymetallic skarn deposits. In this regard, multivariate analyses are generally used to extract significant anomalous geochemical signature of the mineral deposits. In this study, stepwise factor analysis, cluster analysis, and concentration–...

Enhancing the mechanical reliability of metal interconnects is important for achieving highly reliable flexible/wearable electronic devices. In this study, Ag nanowire and Cu thin-film hybrid were explored as a novel concept to enhance under bending fatigue. Bending fatigue tests conducted on thin films Cu/Ag nanowire/polyimide (CAP) interconnects. The increase in resistance was larger than CAP...

Tribological behavior of Cu-MoS2 and Ag-MoS2 nanocomposite lubricant was studied. Cu nanoparticles produced by electrical explosion of copper wires and Ag nanoparticles prepared by electrospark erosion were employed as metal cladding modifiers of MoS2 nanolamellar particles. The tribological tests showed Cu-MoS2 and Ag-MoS2 nanocomposite lubricants changed the friction coefficient of the initia...

Microstructure, precipitation hardening response, and mechanical and physical properties of Cu-Cr-Ag alloy and Cu-Cr-Ag-Ce alloy have been investigated using transmission electron microscopy, scanning electron microscope, optical microscope, electrical conductivity analysis, and tensile test. The influence of element Ce on the matrix refinement, impurity removal, and precipitation in the Cu-Cr-...

Both a Cu-26 wt % Ag (Fe-free) alloy and Cu-26 wt % Ag-0.1 wt % Fe (Fe-doping) alloy were subjected to different heat treatments. We studied the precipitation kinetics of Ag and Cu, microstructure evolution, magnetization, hardness, strength, and electrical resistivity of the two alloys. Fe addition was incapable of changing the precipitation kinetics of Ag and Cu; however, it decreased the siz...

A Ni2+ based colorimetric probe based on glutathione-stabilized silver/copper nanoparticles (GSH-Ag-Cu alloy NPs) in an electrospun polymer matrix is reported. Glutathione-Ag-Cu alloy NPs were characterized by ultraviolet-visible spectroscopy (UV-vis), scanning electron microscopy (SEM) and transmission electron microscopy (TEM). The freshly synthesized GSH-Ag-Cu alloy NPs in a polymer matrix w...

Sn–Ag–Cu composite solders reinforced with nano-sized, nonreacting, noncoarsening 1 wt% TiO2 particles were prepared by mechanically dispersing TiO2 nano-particles into Sn–Ag–Cu solder powder and the interfacial morphology of the solder and flexible BGA substrates were characterized metallographically. At their interfaces, different types of scallop-shaped intermetallic compound layers such as ...

The treatment of EPh2 (E = Te, Se) with Ag(O3SCF3) or Cu(O3SCF3)·1/2C6H6 in dichloromethane yields isomorphous complexes [Ag(TePh2)3](O3SCF3) (1), [Cu(TePh2)3](O3SCF3) (2), and [Cu(SePh2)3](O3SCF3) (3). The related reaction of TeTh2 (Th = 2-thienyl, C4H3S) with Cu(O3SCF3)·1/2C6H6 affords [Cu(TeTh2)3](O3SCF3) (4). While not isomorphic with 1-3, its crystal structure bears a close relationship wi...