نتایج جستجو برای: chip optical interconnects

تعداد نتایج: 315995  

2014
Fanghui Ren Xiangyu Wang Alan X. Wang

We present a surface-normal plasmonic modulator structure for three-dimensional (3-D) optical interconnects using subwavelength metallic photonic crystals. Optical transmission of the metallic slab was controlled by modulating the plasmonic bandgap of the metallic photonic crystal slab with a moderate index perturbation induced by thermo-optic effects. Our experimental results show that more th...

2013
Andreas W. Schell Johannes Kaschke Joachim Fischer Rico Henze Janik Wolters Martin Wegener Oliver Benson

To fully integrate quantum optical technology, active quantum systems must be combined with resonant microstructures and optical interconnects harvesting and routing photons in three diemsnsions (3D) on one chip. We fabricate such combined structures for the first time by using two-photon laser lithography and a photoresist containing nanodiamonds including nitrogen vacancy-centers. As an examp...

2010
Rachid Bouziane Peter Milder Robert Koutsoyannis Yannis Benlachtar Christian R. Berger James C. Hoe Madeleine Glick Robert I. Killey

We designed at the register-transfer-level the DSP circuits for a 21.8 Gb/s QPSK-OFDM transceiver, and carried out synthesis and simulations assessing performance, power consumption and chip area, to determine their suitability for low-cost optical interconnects.

2010
A. V. Krishnamoorthy R. Ho X. Zheng G. Li D. Feng P. Dong T. Pinguet A. Mekis H. Schwetman J. Lexau D. Patil F. Liu P. Koka M. McCracken I. Shubin H. Thacker Y. Luo K. Raj M. Asghari J. G. Mitchell J. E. Cunningham

We review the potential benefits and challenges for achieving optical-interconnects to the chip via the native integration of silicon photonics components with VLSI electronics; and review the “macrochip” – a collection of contiguous silicon chips enabled by optical proximity communication. We summarize recent progress towards achieving low-power photonic links for the macrochip.

2003
Krishna Saraswat Pawan Kapur Shukri Souri

Continuous scaling of VLSI circuits can pose significant problems for interconnects, especially for those responsible for long distance communication on a high performance chip. Both power and delay of these interconnects is likely to rise significantly in the future. International Technology Roadmap for Semiconductors (ITRS) predicts, that in spite of new materials like Cu and low-k dielectric...

Journal: :Optics express 2009
Ye Zhou Vadim Karagodsky Bala Pesala Forrest G Sedgwick Connie J Chang-Hasnain

We propose a novel ultra-low loss single-mode hollow-core waveguide using subwavelength high-contrast grating (HCG). We analyzed and simulated the propagation loss of the waveguide and show it can be as low as 0.006 dB/m, three orders of magnitude lower than the lowest loss of the state-of-art chip-scale hollow waveguides. This novel HCG hollow-core waveguide design will serve as a basic buildi...

2010
K. Huybrechts S. Keyvaninia S.Stankovic M. Tassaert P. De Heyn

In this paper we review our work in the field of heterogeneous III-V semiconductor/silicon photonic integrated circuits for application in Fiber-to-the-Home optical access networks and chip-scale optical interconnects. Several optical and opto-electronic components realized on this platform are described. The fabrication of the silicon waveguide structures is done in a CMOS pilot line on 200mm ...

2002
Christof Debaes Michael Vervaeke Valérie Baukens Wim Meeus Patrik Tuteleers Marnik Brunfaut Jan Van Campenhout Hugo Thienpont

We fabricated and replicated in semiconductor compatible plastics a multi-channel free-space optical interconnection module designed to establish intra-chip interconnections on an Opto-Electronic Field Programmable Gate Array (OE-FPGA). The micro-optical component is an assembly of a refractive lenslet-array and a high-quality microprism. Both components are prototyped using deep lithography wi...

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