Water vapor jet assisted metal cutting is a pollution-free green cutting technique. This paper has developed a three-dimensional finite element model of water vapor jet assisted cutting in order to understand the influence of its cooling and lubricating effect on cutting process. The cooling effect of water vapor jet is modeled with a convective heat transfer coefficient. A window with the temp...

Cooling times for various autoclave loads were recorded using thermocouples. Loads which may be encountered during normal laboratory working require between 17 and 174 minutes to cool to 100 degrees, C and up to 260 minutes to cool to 95 degrees C. Such long cooling times had an adverse effect on nutritive properties of bacteriological culture medium. Observations are made on some factors which...

We predict that graphene is a unique system where disorder-assisted scattering (supercollisions) dominates electron-lattice cooling over a wide range of temperatures, up to room temperature. This is so because for momentum-conserving electron-phonon scattering the energy transfer per collision is severely constrained due to a small Fermi surface size. The characteristic T(3) temperature depende...

A quantum resonator in a thermal-equilibrium state with high temperature has large average population and is featured significant occupation over Fock states excitation number. The could be cooled down via continuous measurements on the ground of coupled two-level system (qubit). We find, however, that measurement-induced cooling might become inefficient high-temperature regime. Beyond conventi...

A green and efficient ionic liquid-based ultrasound-assisted in-situ solvent formationmicroextraction (IL-UA-ISFME) in combination with high-performance liquid chromatographyultravioletdetection (HPLC-UV) has been successfully developed for the trace determination offive selected polycyclic aromatic hydrocarbons (PAHs) in environmental water samples. In thismethod, a hydrophobic ionic liquid (1...

Increases in microprocessor power dissipation and the resulting effect on the cost and complexity of thermal management solutions has been well documented in recent years. Accompanying this increase in overall power dissipation has been a reduction in feature size due to process improvements resulting in a steady decrease in the size of the processing core where most of the power on a die is ge...