DC electric potential technique has been used to monitor crack growth in conductive materials. A constant DC current is passed through these materials and the crack length is measured through the changes in the electrical voltage at the crack mouth. However, this method is not applicable in crack growth measurement in nonconductive materials or adhesively bonded joints. For these materials, a n...

A permeable crack model is proposed to analyze crack growth in a piezoelectric ceramic. In this model, a permeable crack is modeled as a vanishing thin, finite dimension, rectangular slit with dielectric medium inside. A first-order approximation solution is derived in terms of the slit height, h0 . The main contribution of this paper is that the newly proposed permeable crack model reveals tha...

A new experimental method, called the 'hole filling method', is proposed to simulate the healing of internal cracks in rolled workpieces. Based on the experimental results, the evolution in the microstructure, in terms of diffusion, nucleation and recrystallisation were used to analyze the crack healing mechanism. We also validated the phenomenon of segmented healing. Internal crack healing inv...

The evolution of the crack growthspeed in a thin, buckled strip delamina-tion is studied and two approximate solu-tions are presented. The quasi-dynamicanalysis assumes that the deflection ofthe delaminated layer is represented bythe static postbuckling solution for thecurrent delamination length. A refinedanalysis introduces an indeterminateamplitude functio...

A software tool for automated crack onset and growth simulations based on the eXtended Finite Element Method (X-FEM) has been developed. For the first time, this tool is able to simulate arbitrary crack growth and composite delamination without remeshing. The automated tool is integrated with Abaqus/Standard and Abaqus/CAE via the customization interfaces. It seamlessly works with the Commercia...

BACKGROUND Slow crack growth can be described in a v (crack velocity) versus KI (stress intensity factor) diagram. Slow crack growth in ceramics is attributed to corrosion assisted stress at the crack tip or at any pre-existing defect in the ceramic. The combined effect of high stresses at the crack tip and the presence of water or body fluid molecules (reducing surface energy at the crack tip)...

By partitioning the total stresses in a damaged composite into either mechanical and residual stresses or into initial and perturbation stresses, it was possible to derive several exact results for the energy release rate due to crack growth. These general results automatically include the effects of residual stresses, traction-loaded cracks, and imperfect interfaces. The exact energy release r...

By partitioning the total stresses in a damaged composite into either mechanical and residual stresses or into initial and perturbation stresses, it was possible to derive several exact results for the energy release rate due to crack growth. These general results automatically include the effects of residual stresses, traction-loaded cracks, and imperfect interfaces. The exact energy release r...

Fatigue damage is considered to be one of the most critical phenomenon, contributing to the failure of an aircraft structure. Understanding the fatigue mechanism is essential for considering the different technical conditions that influence the fatigue life of structures. In recent years, fatigue tests are accelerated in order to reduce the testing time of materials/structures being developed, ...