Abstract In the shipbuilding industry, risk of brittle fractures is relatively high because some units operate in arctic or subarctic zones and use thickness (up to 100 mm) steel plates their structures. This limited by employing certified materials with a specific impact strength, determined using Charpy method (for given design temperature) exercising control over welding processes (technolog...

This paper studies the failure mechanisms and the reliability of the chip-metallization of a new power module using a copper clip soldered on the top side of the chip, instead of aluminum wire bonds. Both power cycling tests and thermo-mechanical Finite Elements simulations are performed. This study takes advantages of the numerical simulations to analyze in details plastic strains and crack gr...

Carbide-free bainitic (CFB) steels with a matrix of ferrite and thin layers retained austenite, to reduce the manufacturing costs, usually do not contain alloying elements. However, few reports were presented regarding effect elements on properties these steels. Thus, this study evaluates effects vanadium rare earth (Ce-La) microalloying structure, phase transformation kinetics, mechanical carb...

An experimental investigation dealing with failure characterization of 63/37 soldercopper interfaces is presented. The method of moird interferometry is used for mapping elasto-plastic deformations in bimaterials subjected to predominantly tensile loading. A method for quantifying the fracture parameter--the J-integral--using full-field measurement of crack opening displacements has been develo...

In this paper, the thermo-mechanical reliability of Cu/ultra low-k interconnects under chip to package interaction was investigated using finite element modeling and modified edge liftoff test (MELT). The crack propagation behavior in the low-k interconnect was simulated based on the crack tip opening displacement method (CTOD) and the maximum hoop stress criterion. In a six-level Cu/low-k inte...

Large deformation finite element analysis has been carried out to investigate the stress-strain fields ahead of a growing crack for compact tension (a/W=0.5) and three-point bend (a/W=0.1 and 0.5) specimens under plane stress condition. The crack growth is controlled by the experimental J-integral resistance curves measured by Sun et al. The results indicate that the distributions of opening st...