نتایج جستجو برای: delamination toughness

تعداد نتایج: 11872  

Bioglass-graphene oxide composites can be served as a high-potential candidate for biomedical applications due to its specific mechanical properties. In this study, the 45S5 bioactive glass (BG) - graphene oxide (GO) composite containing 2 wt. % GO was coated on titanium alloy via electrophoretic deposition process (EPD). The synthesized GO was incorporated into BG coating to improve the mechan...

2009
N. Hu A. M. Elmarakbi

A new cohesive model for simulating delamination propagation in composite laminates under transverse loads. Running title: A new cohesive model for simulating delamination propagation in composite laminates 2 Abstract In this paper, we propose a new cohesive model to stably and accurately simulate the delamination propagations in composite laminates under quasi-static and low-velocity impact tr...

2016
M. RAVANDI

The mode I interlaminar fracture toughness of stitched and unstitched composite laminates of continuous UD flax fiber and epoxy matrix was experimentally and numerically investigated. A twistless flax fiber yarn was used for stitching purpose. The mode I interlaminar energy release rate of the unstitched and stitched laminates was experimentally determined through Double Cantilever Beam (DCB) t...

1998
W. T. Chow S. N. Atluri

A ``mutual integral'' approach is used to calculate the mixed-mode stress intensity factors for a free-edge delamination crack in a laminate under tensile loading conditions. This ``mutual integral'' approach, for generalized plane strain conditions, is based on the application of the path-independent J integral to a linear combination of three solutions: one, the problem of the laminate to be ...

Journal: :Algorithms 2009
Stefano Mariani

We present a coupled finite element, Kalman filter approach to foresee impactinduced delamination of layered composites when mechanical properties are partially unknown. Since direct numerical simulations, which require all the constitutive parameters to be assigned, cannot be run in such cases, an inverse problem is formulated to allow for modeling as well as constitutive uncertainties. Upon s...

2008
Shengguo Jia Sarbajit Banerjee Dongyun Lee Joze Bevk Jeffrey W. Kysar Irving P. Herman

We have studied the fracture, strain, and stress of electrophoretically deposited EPD films of CdSe nanocrystals as a function of the film thickness, nanocrystal size, and drying method. Fracture results from the film stress that develops with the loss of residual solvent after EPD when the film exceeds a threshold thickness that increases with nanocrystal core diameter from 300 to 1200 nm for ...

2017
Davide De Cicco Zohreh Asaee Farid Taheri

This review paper aims at reporting some of the notable works carried out concerning the use of nanoparticles (NPs) as a means of improving the resistance of fiber-reinforced polymer composite materials (FRPs) and adhesively bonded joints (ABJs) to delamination initiation and propagation. Applications of various nanoparticles, such as carbon-based, ceramic-based and mineral-based are discussed....

1988
John H. Crews James R. Reeder

1 SUMMARY A mixed-mode delamination test procedure was developed combining double cantilever beam (DCB) mode I loading and end notch flexure (ENF) mode II loading on a split unidirectional laminate. By loading the specimen with a lever, a single applied load simultaneously produces mode I and mode II bending loads on the specimen. This mixed-mode bending (MMB) test was analyzed using both finit...

Journal: :Microelectronics Reliability 2006
Y. L. Zhang D. X. Q. Shi W. Zhou

Interface reliability issue has become a major concern in developing flip chip assembly. The CTE mismatch between different material layers may induce severe interface delamination reliability problem. In this study, multifunctional micro-moiré interferometry (MI) system was utilized to study the interfacial response of flip chip assembly under accelerated thermal cycling (ATC) in the temperatu...

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