نتایج جستجو برای: electro spark microwelding

تعداد نتایج: 28994  

Journal: :Journal of The European Ceramic Society 2021

The electrical and thermal contact resistances are key parameters for obtaining an accurate electro-thermal model of the spark plasma sintering (SPS) process. However, due to lack a general expression, these usually determined empirically. Thus, they only valid specific material SPS configuration. A simple method based on limited amount experiments as well new formulation developed. First, evol...

2013
Kumar Sandeep

EDM is an unconventional electro thermal machining process used for manufacturing geometrically complex or hard material parts that are extremely difficult-to-machine by conventional machining process. The process involves a controlled erosion of electrically conductive materials by the initiation of rapid and repetitive spark discharges between the tool and work piece separated by a small gap ...

Journal: :Applied optics 2012
Huan Huang Lih-Mei Yang Jian Liu

In this paper, methods of welding and sealing optically transparent materials using an ultrashort pulsed (USP) fiber laser are demonstrated which overcome the limit of small area welding of optical materials. First, the interaction of USP fiber laser radiation inside glass was studied and single line welding results with different laser parameters were investigated. Then multiline scanning was ...

2014
Alakesh Manna Anup Malik

The e-glass fibre epoxy composite is a nonconductive ceramic material hence it is difficult to machine by any well known non-conventional machining methods like electrical discharge machining, wire electrical discharge machining etc. This material can be machined with conventional machining but compromise with accuracy, surface texture even not possible to micro slicing etc. Keeping in view, a ...

Journal: :The International Journal of Advanced Manufacturing Technology 2022

Due to their excellent physical and mechanical properties, third-generation super-hard semiconductor materials (such as SiC, GaN) are used widely in the field of microelectronics. However, due its ultra-high hardness, machining is very difficult, which has become bottleneck development. Slicing first procedure that directly affects subsequent process. Fixed abrasive diamond wire saw (DWS) been ...

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