This paper focused on a novel method of electroless plating ruthenium (Ru) on solid or porous substrates like porous stainless steel (PSS) discs or ceramic tubes. A novel complexing plating bath of Ru was developed. It is proven that Ru can be deposited directly on these substrates by the bath at a temperature of 328 K and strong alkaline environment. TGA, SEM, EDX and XRD confirmed the success...

Lead-free soldering for electronic industry is a segment of global trend toward lead-free environment. Although initiated in U.S. in early 1990’s, it advanced much more rapidly in Japan and Europe. This differentiation in Pb-free progress triggered great concerns of users of Pb-containing solders about maintaining business opportunity, therefore further expedites the advancement of Pb-free sold...

We present an original two-step method for the deposition via precipitation of Pd nanoparticles into macroporous silicon. The method consists in immersing a macroporous silicon sample in a PdCl2/DMSO solution and then in annealing the sample at a high temperature. The impact of composition and concentration of the solution and annealing time on the nanoparticle characteristics is investigated. ...

Brittle solder joints in Electroless Ni electroless Pd immersion Au (ENEPIG) surface finishes are one of the key re­ liability issues in electronics assembly. Previous characterization of the reflow process has indicated that interfa­ cial voids formed after solder reflow are responsible for the decreases in solder joint strength. However, the mechanisms behind the formation of these voids in t...

in this research, tribological characteristics of ni-p electroless coating and double-layered ni-p/ni-b electroless coating were studied. for this purpose, ni-p electroless coating with 25 μm thickness was initially applied to the surface of steel ck45 samples; then, a double-layered ni-p/ni-b electroless coating, including inner layer of ni-p with 15 μm thickness and outer layer of ni-b with 1...

A scalable, low-cost process for fabricating copper-based microwave components on flexible, paper-based substrates is demonstrated. An inkjet printer is used to deposit a catalyst-bearing solution (tailored for such printing) in a desired pattern on commercially-available, recyclable, non-toxic (Teslin®) paper. The catalystbearing paper is then immersed in an aqueous copper-bearing solution to ...

Electroless metal plating in combination with nanochannel-containing templates is a versatile method for the fabrication of metal nanotubes [1]. In contrast to the electrodeposition of metals, electroless plating relies on the surface-selective chemical reduction of a metal precursor [2]. The simultaneous coverage of the whole template surface with metal nanoparticles favors the formation of tu...