نتایج جستجو برای: electroless plating
تعداد نتایج: 10398 فیلتر نتایج به سال:
The Ni-B-P alloy coatings were made autocatalytically (electroless) using an alkaline plating bath with nickel chloride hexahydrate (NiCl2.6H2O) as the source of nickel ions, sodium borohydride (NaBH4) and sodium hypophosphite (NaH2PO2) as reducing agents and source of boron and phosphorous ions, respectively. The effects of bath concentrations on the plating rate, composition of coating, surfa...
Electroless metal plating in combination with nanochannel-containing templates is a versatile method for the fabrication of metal nanotubes [1]. In contrast to the electrodeposition of metals, electroless plating relies on the surface-selective chemical reduction of a metal precursor [2]. The simultaneous coverage of the whole template surface with metal nanoparticles favors the formation of tu...
Advanced hybrid microelectronics require high performance packaging materials and components. Alumina, the most widely used ceramic material in microelectronics, is being replaced by new high performance materials such as aluminum nitride (AlN) and beryllia (BeO). AlN's thermal conductivity is an order of magnitude greater than alumina and it has a thermal expansion coefficient very close to si...
A 3-dimensional porous material prepared by transferring a sponge structure of biomineral is coated nickel via aqueous electroless plating.
Electroless cobalt films have been obtained by deposition using a plating bath containing two reducing agents: dimethylamineborane (DMAB) and sodium hypophosphite. This formulation allows spontaneous activation on copper followed by auto catalytic electroless plating. CoWBP and CoBP films are proposed as diffusion barriers and encapsulation layers, for copper lines and via contacts for ULSI int...
Electroless plating is a chemical reduction process which depends upon the catalytic reduction of a metallic ion in an aqueous solution containing a reducing agent without the use of electricity (1). Cahill (2) showed that the cupric ion could be reduced autocatalytically with formaldehyde in an alkaline solution. Okinaka (3 ) established that the overall reaction of the catalytic copper platin...
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