نتایج جستجو برای: electroless plating

تعداد نتایج: 10398  

Journal: :Sen'i Gakkaishi 1986

2014
P. G. Venkatakrishnan S. S. Mohamed Nazirudeen Sankara Narayanan

The Ni-B-P alloy coatings were made autocatalytically (electroless) using an alkaline plating bath with nickel chloride hexahydrate (NiCl2.6H2O) as the source of nickel ions, sodium borohydride (NaBH4) and sodium hypophosphite (NaH2PO2) as reducing agents and source of boron and phosphorous ions, respectively. The effects of bath concentrations on the plating rate, composition of coating, surfa...

Journal: :Journal of The Surface Finishing Society of Japan 2019

Journal: :Journal of The Surface Finishing Society of Japan 2015

Journal: :Journal of the Metal Finishing Society of Japan 1985

2011
F. Münch U. Kunz C. Neetzel S. Lauterbach H.-J. Kleebe W. Ensinger M. A. Sanchez-Castillo C. Couto W. B. Kim L. Z. Hua A. Rydh W. K. Kwok

Electroless metal plating in combination with nanochannel-containing templates is a versatile method for the fabrication of metal nanotubes [1]. In contrast to the electrodeposition of metals, electroless plating relies on the surface-selective chemical reduction of a metal precursor [2]. The simultaneous coverage of the whole template surface with metal nanoparticles favors the formation of tu...

2014
Michael Cima

Advanced hybrid microelectronics require high performance packaging materials and components. Alumina, the most widely used ceramic material in microelectronics, is being replaced by new high performance materials such as aluminum nitride (AlN) and beryllia (BeO). AlN's thermal conductivity is an order of magnitude greater than alumina and it has a thermal expansion coefficient very close to si...

Journal: :Materials advances 2022

A 3-dimensional porous material prepared by transferring a sponge structure of biomineral is coated nickel via aqueous electroless plating.

2007
R. Ofek Almog Y. Sverdlov I. Goldfarb Y. Shacham-Diamand

Electroless cobalt films have been obtained by deposition using a plating bath containing two reducing agents: dimethylamineborane (DMAB) and sodium hypophosphite. This formulation allows spontaneous activation on copper followed by auto catalytic electroless plating. CoWBP and CoBP films are proposed as diffusion barriers and encapsulation layers, for copper lines and via contacts for ULSI int...

2003
Paul L. Bishop

Electroless plating is a chemical reduction process which depends upon the catalytic reduction of a metallic ion in an aqueous solution containing a reducing agent without the use of electricity (1). Cahill (2) showed that the cupric ion could be reduced autocatalytically with formaldehyde in an alkaline solution. Okinaka (3 ) established that the overall reaction of the catalytic copper platin...

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