We present a technique for patterning thin-film metals (silver and gold) without the need for photolithography. The technique involves microfluidics and can be performed on planar or curved surfaces. Patterns of thin-film metal are fabricated by flowing electroless silver or gold plating solutions through predefined microchannels made of polydimethylsiloxane sealed against a surface of interest...

We describe a technique to integrate embedded microelectrodes and optical waveguides in Lithium niobate (LiNbO3) using a femtosecond laser, and a Y-splitter modulator was demonstrated. The Y-splitter was fabricated by femtosecond laser direct writing and the embedded microelectrodes were fabricated by combining femtosecond laser ablation with selective electroless plating. The embedded microele...

We present an original two-step method for the deposition via precipitation of Pd nanoparticles into macroporous silicon. The method consists in immersing a macroporous silicon sample in a PdCl2/DMSO solution and then in annealing the sample at a high temperature. The impact of composition and concentration of the solution and annealing time on the nanoparticle characteristics is investigated. ...

As the laminate substrate industry moves from Hot Air Solder Level (HASL) finishes, alternate plating finishes are being proposed such as immersion gold/electroless nickel, electroless palladium and electroless silver. This paper presents results of an evaluation of the thermosonic gold ball wire bondability of electroless palladium. Two palladium thicknesses, with and without a nickel underlay...

Cu-filled TSV (through silicon via) is important technology for 3-D LSIs in order to obtain higher packing density, faster signal transmission, and lower power consumption. Diameter of TSV is expected to be smaller than 2 μm, and its aspect ratio to be larger than 10 in near future [1]. For realizing a high aspect ratio Cu-filled TSV, it is essentially important to form the barrier and seed lay...

The Ni-B-P alloy coatings were made autocatalytically (electroless) using an alkaline plating bath with nickel chloride hexahydrate (NiCl2.6H2O) as the source of nickel ions, sodium borohydride (NaBH4) and sodium hypophosphite (NaH2PO2) as reducing agents and source of boron and phosphorous ions, respectively. The effects of bath concentrations on the plating rate, composition of coating, surfa...