Diverse non-equilibrium eutectic structures have attracted numerous experimental and theoretical studies. One special type is the formation of a halo of one phase around a primary dendrite of another phase. In our experiments, it was occasionally observed that ScNi halos grow as dendritic morphology around the primary Sc 2 Ni dendrites in an arc-melted ScNi-Sc 2 Ni off-eutectic binary alloy. Th...

This study presents an electrical current testing that is based on the Sn­xAg­0.5Cu (x = 1, 3mass%) photovoltaic (PV) ribbon, and investigates the growth mechanism of the intermetallic compounds (IMCs). The microstructure of both alloy solders contains the eutectic region (¢-Sn+Cu6Sn5+Ag3Sn) and the base phases (¢-Sn). The eutectic phases in the Sn­3Ag­0.5Cu (SAC305) alloy presented a continuou...

GaInSn, a eutectic alloy, has been successfully used in the Magneto-Thermofluid Research Laboratory at the University of California-Los Angeles and at the Princeton Plasma Physics Laboratory for the past six years. This paper describes the handling and safety of GaInSn based on the experience gained in these institutions, augmented by observations from other researchers in the liquid metal expe...

Laser remelting has been performed on Ni-30 wt.% Sn hypoeutectic alloy. An anomalous eutectic formed at the bottom of the molten pool when the sample was remelted thoroughly. 3D morphologies of the α-Ni and Ni3Sn phases in the anomalous eutectic region were obtained and investigated using serial sectioning reconstruction technology. It is found that the Ni3Sn phase has a continuous interconnect...

A combination of electron microscopy, focused ion beam and conductive atomic force microscopy techniques have been used to study the microstructure, oxide scale development, and electrical behavior of a Cu–9 at.% La alloy. The as-cast alloy exhibits a eutectic microstructure comprising 30 vol.% Cu rods in a Cu6La matrix. The eutectic colonies exhibit a singular orientation relationship with [01...

Au (0.05 μm) 69.4 μm Electromigration may affect the reliability of flip-chip solder joints. Eutectic solder is a two-phase alloy, so its electromigration behavior is different from that in aluminum or copper interconnects. In addition, a flipchip solder joint has a built-in currentcrowding configuration to enhance electromigration failure. To better understand electromigration in SnPb and lead...

Commercial, aluminum die-cast alloys are subject to long-term stresses leading to viscoelastic material responses resulting in inefficient engine operation and failure. Constant load creep tests were conducted on aluminum die-casting alloys: B-390, eutectic Al-Si and a 17% Si-Al alloys. Rupture occurred in the primary creep regime, with the eutectic alloy having the longest times to failure. Pr...

Young’s modulus (E) values published in the literature for the eutectic Pb37/Sn63 and near eutectic Pb40/Sn60 solder alloy vary significantly. One reason for this discrepancy is different testing methods for highly rate sensitive heterogeneous materials, like Pb/Sn alloys, yield different results. In this paper, we study different procedures used to obtain the elastic modulus; analytically, by ...

Rapid solidification experiments have been performed on an Ni-25.3 at.% Si alloy using drop tube techniques. The dominant phase formed is found to be Ni25Si9, with Ni31Si12 and く1-Ni3Si also being present. SEM and TEM analysis revealed a novel eutectic structure consisting of lamellar of metastable Ni25Si9 and く1-Ni3Si, the width of these being around 200 nm and 20 nm respectively. This result ...

It is well known that semi-solid forming could only obtain coarse-grained microstructure in a few alloy systems with a low melting point, such as aluminum and magnesium alloys. This work presents that semi-solid forming could also produce novel bimodal microstructure composed of nanostructured matrix and micro-sized (CoFe)Ti2 twins in a titanium alloy, Ti62Nb12.2Fe13.6Co6.4Al5.8. The semi-solid...