We have created insulated C60 nanowire by packing C60 molecules into the interior of insulating boron nitride nanotubes (BNNTs). For small-diameter BNNTs, the wire consists of a linear chain of C60 molecules.With increasing BNNT inner diameter, unusual C60 stacking configurations are obtained (including helical, hollow core, and incommensurate) that are unknown for bulk or thin-film forms of C6...

High voltage and high current power modules are key components for traction applications. In the future, railway locomotives, tramways and elevators will be equipped with Insulated Gate Bipolar Transistor (IGBT) modules. In this field of application high reliability is of decisive importance, especially for aluminum bond wires with diameters up to 500 μm, connecting the silicon device with the ...

The augment of heat transfer and fluid of buoyancy-driven flow of Fe3O4-Water nanofluid in a square cavity under the influence of an external magnetic field is studied numerically. Cold temperature is applied on the side (vertical) walls and high temperature is imposed on the bottom wall while the top wall is kept at thermally insulated. The governing non-dimensional differential equations are ...

We report experimental laboratory studies on developing conductive pathways, or wires, using protoplasmic tubes of plasmodium of acellular slime mould Physarum polycephalum. Given two pins to be connected by a wire, we place a piece of slime mould on one pin and an attractant on another pin. Physarum propagates towards the attract and thus connects the pins with a protoplasmic tube. A protoplas...

A simplified method to manufacture durable, glass-insulated, tungsten microelectrodes with sufficient control of the final electrode impedance is described. This method requires only two instruments, an electrolytic etcher for wires and pipette puller, for manufacturing these electrodes. The manufacture of these electrodes involves 3 steps: (1) etching tungsten wire to sharpen the tip, (2) insu...

Nowadays, the wire harness assembly process is still manually performed due to complexity and product variability (e.g., wires of different kind, size length). The Wire cobots project, in which this work was conceived, aims at improving current state-of-art by introducing it collaborative robotics. A shared workstation exploiting human abilities machine strengths developed automotive means insu...

Wire bonding technology has been dominant over soldering joint method for electronic packages especially low I/O density due to its assembly simplicity. Bond wires are composed , at most, of a combination two different metals, which Pd-coated Cu and Au-coated Ag wires. Those possess conductive metal surfaces, do not allow electrical insulation, corrosion resistance strong adhesion polymeric enc...