András Nemes1,†, David Lo Jacono1,2, Hugh M. Blackburn3 and John Sheridan1 1Fluids Laboratory for Aeronautical and Industrial Research (FLAIR), Department of Mechanical and Aerospace Engineering, Monash University, Clayton, VIC 3800, Australia 2Institut de Mécanique des Fluides de Toulouse (IMFT), CNRS, UPS, Université de Toulouse, Allée Camille Soula, 31400 Toulouse, France 3Department of Mech...

Abstract—We present exact three-dimensional semi-analytical expressions of the force exerted between two coaxial thick coils with rectangular cross-sections. Then, we present a semi-analytical formulation of their mutual inductance. For this purpose, we have to calculate six and seven integrations for calculating the force and the mutual inductance respectively. After mathematical manipulations...

In this work we present a novel, inductance-based system to measure and control the motion of bellows-driven continuum joints in soft robots. The sensing system relies on coils of wire wrapped around the minor diameters of each bellows on the joint. As the bellows extend, these coils of wire become more distant, decreasing their mutual inductance. Measuring this change in mutual inductance allo...

This paper deals with an efficient and fast approach for determining the mutual inductance between coaxial circular coils of rectangular cross section in combination with thin coaxial circular coils as the thin wall solenoid, the thin disk coil and the filamentary coil. This approach is based on the filament method where conductors are approximated by the set of Maxwell’s coils. The obtained ex...

With operating frequencies reaching the multi-GHz range, the role of on-chip inductance is becoming increasingly significant. The inclusion of inductance in the interconnect model is particularly necessary in clock distribution networks and also in signal and power lines, which have wide wires and hence low resistance. The principal complexity in the extraction of inductance is that one needs t...

The goal of this work was to model the influence of the substrate skin effects on the distributed mutual impedance per unit length parameters of multiple coupled onchip interconnects. The proposed analytic model is based on the frequency-dependent distribution of the current in the silicon substrate and the closed form integration approach. It is shown that the calculated frequency-dependent di...

Aiming at achieving high robustness performance in Wireless Power Transfer (WPT) systems for moving robot power supply, this paper proposes a H∞ robust control method with multiple parameters that vary randomly, including the mutual inductance, load parameter, and operating frequency. These uncertain parameters make the system control extremely difficult. A composite Upper Linear Fractional Tra...

On-chip inductance is becoming increasingly important as technology continues to scale. This paper describes a way to characterize inductive effects in interconnects. It uses realistic test structures that study the effect of mutual couplings to local interconnects, to random lines connected to on-chip drivers, and to typical power and ground grids. The use of parameters to characterize the ind...