Sn–Ag–Cu composite solders reinforced with nano-sized, nonreacting, noncoarsening 1 wt% TiO2 particles were prepared by mechanically dispersing TiO2 nano-particles into Sn–Ag–Cu solder powder and the interfacial morphology of the solder and flexible BGA substrates were characterized metallographically. At their interfaces, different types of scallop-shaped intermetallic compound layers such as ...

A very simple method for synthesizing nanosize-controllable (4–40 nm) metals (Cu, Ag, Pd, Rh and Ni) or alloys within carbon shells has been developed. The thickness of the carbon shell that prevents the core metals from being aggregated or oxidized ranges from 3–5 nm. In addition, the synthesized metal nanoparticles exhibit a correlation between dpZ/R (Z = valence of metal and R = atomic radiu...

Pine needle-like Pd micro/nano-leaves have been synthesized by a facile, template-free electrochemical method. As-synthesized Pd micro/nano-leaves were directly electrodeposited on an indium tin oxide substrate in the presence of 1.0 mM H2PdCl4 + 0.33 M H3PO4. The formation processes of Pd micro/nano-leaves were revealed by scanning electron microscope, and further characterized by X-ray diffra...

Monodisperse bimetallic Pd-Cu nanoparticles with controllable size and composition were synthesized by a one-step multiphase ethylene glycol (EG) method. Adjusting the stoichiometric ratio of the Pd and Cu precursors afforded nanoparticles with different compositions, such as Pd(85)-Cu(15), Pd(56)-Cu(44), and Pd(39)-Cu(61). The nanoparticles were separated from the solution mixture by extractio...

Atomic hydrogen adsorption energies on bimetallic overlayer systems have been determined by periodic density functional theory calculations within the generalized gradient approximation. On the pseudomorphic Pd/Cu(111) surface, both the substrate interaction and the lattice compression of the Pd overlayer lead to smaller hydrogen binding energies. For pseudomorphic Cu/Pd(111), on the hand, the ...

Using low-energy electron microscopy, we measure the diffusion of Pd into bulk Cu at the Cu(100) surface. Interdiffusion is tracked by measuring the dissolution of the Cu(100)-c(2 × 2)-Pd surface alloy during annealing (T>240 °C). The activation barrier for Pd diffusion from the surface alloy into the bulk is determined to be (1.8 ± 0.6) eV. During annealing, we observe the growth of a new laye...

In electrochemical loading of Pd with deuterium, it has been known that attaining a D/Pd value larger than 0.88 is necessary for triggering excess heat effects [1]. It has been reported by Arata and Zhang that the heat arising from D-D nuclear fusion reaction in solid is observed simply by pressurizing nano-Pd/ZrO2 system with deuterium gas [2]. It seems that nano-scale Pd particles absorb more...

  In this work,copper/palladium (Cu/Pd) multilayer nanowires were successfully prepared by electrodeposition method using polycarbonate template. The fabrication of Pd/Cu multilayer nanowires was controlled by analyzing the current–time transient during electrodeposition using potentiostat. The morphological properties of the nanowires were studied by scanning electron microscopy (SEM) and resu...

Discrete homo Cu-Cu-Cu and hetero Cu-Pd-Cu or Cu-Co-Cu metal arrays are prepared within an organic-pillared coordination box by inserting M(ii)-azaporphine/porphine cartridges (M = Cu(ii), Pd(ii) or Co(ii)), where the metal arrays show unique spin interactions in ESR: in particular, Deltam(s) = 3 for the Cu-Cu-Cu array.

Three types of inexpensive Pb-free solder joints, namely Zn-based and Bi-based solders, and a CuSn alloy were studied for application to the high-temperature operation of wide band-gap power semiconductor devices using GaN or SiC. Zn– Al solder sheets, whose melting point is 380°C were prepared, and then surface oxides were removed by RF plasma etching. Subsequently, Cu thin films were deposite...