نتایج جستجو برای: power integrated circuit
تعداد نتایج: 813685 فیلتر نتایج به سال:
A bolometer thermometer with a thermal capacity C is coupled to a temperature T. 0 through a heat conductivity G and receives the power.Bolometers made with a square mesh structure can be assembled. Show a wide feature of noise not explained by the basic theory. A bolometer is a device for measuring the power of incident electromagnetic radiation via the heating of a material with a temperature...
Researchers at Oak Ridge National Laboratory (ORNL) are developing selectively coated cantilever arrays in a surface-micromachined MEMS process for very high sensitivities in chemical and biological sensing. Toward this end, we have developed a one-dimensional (1-D) 10-element microcantilever array that we have coated with gold for mercury sensing and palladium for hydrogen sensing. Ultimately ...
Transistor scaling has allowed a large number of circuits to be integrated into integrated circuit (IC) chips implemented in nanometer CMOS technology nodes. However, dark silicon which signifies for under-utilized circuitry will become dominant in future chips due to limited thermal design power (TDP). Furthermore, large voltage loss due to complex routing and placement will also degrade the p...
Realization of a novel single-resistance-controlled oscillator, employing an active element and all grounded passive elements, is the purpose of this manuscript. With requirements for completing the design being only a single Voltage Differencing Current Conveyor and four grounded passive components, it is also a preferable choice for integrated circuit implementation. The designed circuit has ...
Increasing digital system complexity and integration density motivate automation of the integrated circuit design process. High-level synthesis is a promising method of increasing designer productivity. Continued process scaling and increasing integration density result in increased power consumption, power density, and temperature. High-level synthesis for integrated circuit (IC) power and the...
Keywords: Power electronics High temperature Shear Creep Nano-indentation Hardening a b s t r a c t An experimental investigation of two potential candidate materials for the diamond die attachment is presented in this framework. These efforts are motivated by the need of developing a power electronic packaging for the diamond chip. The performance of the designed packaging relies particularly ...
This paper presents the development of a printed circuit board (PCB) integrated vibration-induced power generator with total volume of ~1cm that uses lasermicromachined springs as resonating structures. The goal of our research is to create a minimally sized, economical, and circuit integrated electric power generator capable of producing enough voltage to drive low-power IC circuit or wireless...
We numerically investigate the possibility of using Tunnel field-effect transistor (TFET) in a 32 kHz crystal oscillator circuit to reduce power consumption. A simulation using SPICE (Simulation Program with Integrated Circuit Emphasis) is carried out based on a conventional CMOS transistor model. It is shown that the power consumption of TFET is one-tenth that of conventional low-power CMOS.
This paper is concerned with the mathematical modeling of a Smart High-Side Power IC. Smart Power ICs are power switches with integrated control and protection functions. On the basis of the full circuit of the Smart Power IC, an equivalent circuit, tailored to the needs of systemanalysis and control design, is introduced and mathematically modeled. This allows to model the large signal behavio...
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