This young man presented initially and repeatedly over a period of twenty years with symptoms of irritability, depressed and withdrawn mood, impulsivity, out-of-control behavior, and suicidal ideation and behavior. These symptoms occurred with disabling intensity at ages 3 year, 6 1/2 years, and 8 1/2 years, when he had not yet been adequately diagnosed and treated with appropriate psychopharma...

the kashan erg is one of the most important sand dune complexes in iran. being affected by wind erosion, theerg's borderlands face numerous problems as a result of sand movement. to evaluate the risk of sands moving intoresidential areas near the kashan erg, anemometry data from synoptic stations located in kashan, ardestan, meimeh,naeen, and qom were collected and analyzed to calculate the san...

Background: Constipation is a common complaint during pregnancy. Iranian Traditional Medicine (ITM) has some recommendations for this complaint. Objective: In this study, interventions of constipation in pregnancy have been presented and their efficacy and safety evidence were reviewed from modern literature. Methods: Interventions selected based upon the chapters related to health protectio...

Damascene Cu electroplating for on-chip metallization, which we conceived and developed in the early 199Os, has been central to IBM's Cu chip interconnection technology. We review here the challenges of filling trenches and vias with Cu without creating a void or seam, and the discovery that electrodeposition can be engineered to give filling performance significantly better than that achievabl...

The damascene technology is widely used for Cu interconnect structures in integrated circuits. Due to the strong variation of the feature sizes and densities of Cu interconnect lines and contact pads involved in electromigration (EM) test structures, the CMP of the excessive Cu layer is very complicated. This paper will present the challenges of removing of Cu and Ta by CMP and the successful a...

A compact model for early electromigration failures in copper dual-damascene interconnects is proposed. The model is based on the combination of a complete void nucleation model together with a simple mechanism of slit void growth under the via. It is demonstrated that the early electromigration lifetime is well described by a simple analytical expression, from where a statistical distribution ...