The success of printing technology in the electronics industry primarily depends on the availability of metal printing ink. Various types of commercially available metal ink are widely used in different industries such as the solar cell, radio frequency identification (RFID) and light emitting diode (LED) industries, with limited usage in semiconductor packaging. The use of printed ink in semic...

Abstract Nano-sintered silver has broad development prospects in the field of electronic packaging due to its excellent thermal conductivity and feasibility at low sintering temperatures. In this paper, by using molecular dynamics simulations, a single nano-silver particle is sintered, melting temperature range obtained. Then, SiC/nano-Ag/Cu sintered sample prepared. By observing formation proc...

AIM The aim was to investigate cheese samples for the prevalence of Staphylococcus aureus, evaluate multiplex polymerase chain reaction (PCR) methods for S. aureus identification, as well as to determine the antibacterial activity of silver nanoparticles against such strains. MATERIALS AND METHODS Total of 100 random locally manufactured cheese samples were collected from Qena dairy markets, ...

Nanotechnology can improve the mechanical barrier and antimicrobial (which will not allow invasion of microorganisms in food, increasing food properties, hence be a very promising material for packaging. Nanomaterials keep fresh packaging design. Silver nanoparticles nanoclay represent most nanoempowered available on market others like zinc oxide titanium share little current market. Zinc enhan...

Abstract Packaging materials with thermal management and electromagnetic protection are designed to develop miniaturized high-power airborne electronic equipment meet the overall design requirements. In this study, graphene/paraffin composite material modified by high conductivity particles is used improve conductivity, efficiency, performance. Four kinds of including nickel, silver, copper, he...