Prediction of the deformation characteristics is an important step to understand the workability of alloys during imposing large strains. In this research, severe plastic deformation of Sn-5Sb solder alloy was carried out under different t deformation conditions, including the temperature range of 298, 330, 36, 400 K and die designs. The current study applies an experimentally validated finite ...

Electrochemical migration (ECM) is the growth of conductive metal filaments on a printed circuit board (PCB) through an electrolyte solution under a DC voltage bias. ECM can cause a reduction in surface insulation resistance (SIR) between adjacent conductors, generate a path of leakage current, and lead to intermittent or catastrophic circuit failures. Solder mask has been widely used on printe...

Sn-3.0Ag-0.5Cu (SAC305) alloy is the most widely used solder in electronic assemblies. However, issues associated with cost and drop/shock durability have resulted in a continued search for alternative solder alloys. One approach to improve the drop/shock reliability has been to reduce the silver content in Sn-AgCu alloys. Another approach is doping Sn-Ag-Cu solder with additional elements. Mor...

Recently, the industry has seen an increase in the number of Pb-free solder alloy choices beyond the common neareutectic Sn-Ag-Cu (SAC) alloys. New wave solder alloys have been developed with the intent of addressing concerns with copper dissolution, barrel fill, wave solder defects, and the high cost of alloys containing significant amounts of silver. Concerns regarding the poor drop/shock per...

A simple model of the formation of Au0.1Ni0.1Sn0.8 in Pb-Sn solder/Ni interconnects is examined by numerical simulation. Previous experimental observation has shown that after reflow the interface consists of the Ni3Sn4 alloy between Pb-Sn solder and Ni, with Au distributed through the PbSn solder ball. Au0.1Ni0.1Sn0.8 was observed to form at the Pb-Sn solder/Ni3Sn4 interface during annealing a...

The 6063 Aluminum alloy brazing joint was prepared with the Al-Si12 solder. effect of welding time on structure and shear properties weld is studied interface analyzed. study shows that spreading performance brder gradually increases time, strength aluminum increase first then decreases time. When optimal process 605°C 15min, between solder good, 122.4MPa. To ensure bonding alloy, insulation 15...

Eutectic Sn–Pb is historically the most important solder alloy, thus its reactions will serve as relevant references for Pb-free solder substitutes. Here, an investigation has been carried out to compare the dissolution kinetics of the Cu pad of the ball grid array (BGA) substrate with the molten conventional eutectic Sn–Pb solder having different volumes. BGA solder ball of 760 and 500 m of di...

Recently, it has been reported that the crystal orientation and grain size of the β-Sn phase in Sn-rich solders have profound effects on the reliabilities of Pb-free solder joints, such as thermo-mechanical fatigue, electromigration, and among others. Additionally, it is also known that the microstructure of Sn-rich solders is strongly affected by their alloy composition. In this study, the gra...

Large 6 mm× 9 mm silicon chips have been successfully bonded to alumina substrates with electroplated Au/Sn/Au structure at the eutectic omposition. The new bonding process is entirely fluxless, or flux-free. It is performed in vacuum (50 milliTorrs), where the oxygen content is educed by a factor of 15,200 comparing to air, to inhibit solder oxidation. Eutectic Au80Sn20 alloy is a well establi...

The significant increase in metal costs has forced the electronics industry to provide new materials and methods to reduce costs, while maintaining customers' high-quality expectations. This paper considers the problem of most electronic industries in reducing costly materials, by introducing a solder paste with alloy composition tin 98.3%, silver 0.3%, and copper 0.7%, used for the constructio...