The unprecedented growth in the telecommunications sector in the mid to late 1990’s saw a high demand in the area of optical packages and optical networks. This sudden growth in demand for optical technology in telecom and data communication applications could not be supported by the existing manufacturing infrastructure; so, to meet the growing volume needs of the industry – the electronics ma...

Abstract At present, Sn-3.0Ag-0.5Cu (SAC305) solder is one of the commonly used lead-free solders, and copper-clad laminate PCB substrate. SAC copper substrate mainly generate two intermetallic compounds (IMCs) Cu6Sn5 Cu3Sn during soldering process. Based on first principles, this paper analyzes formation difficulty kinds IMCs generated in soldering, failure mechanism Sn/IMC IMC/Cu interfaces. ...