Adhesive bonding is a well-known technics to assembly dies or wafer on a host substrate through polymer or solder bumps. To combine electronic and photonic systems on a single chip, we propose hereby to use AuSn alloy as bonding medium combined to waferscale technology and post-bonding III-V processing alleviating so the need of alignment accuracy between wafers. For instance, high density LED’...

One of the key fabrication steps of large-area microfluidic devices is the flexible-to-hard sheet alignment and pre-bonding. In this work, the vacuum airbag laminator (VAL) which is commonly used for liquid crystal display (LCD) production has been applied for large-area microfluidic device fabrication. A straightforward, efficient, and low-cost method has been achieved for 400 × 500 mm2 microf...

INTRODUCTION For HOM loads proposed for the Energy Recovery Linac injector cavities we used different materials for absorption, two kinds of ferrites and a ceramic-like material with a trade name “ceralloy”. These materials were brazed or soldered to a metal substrate. One important requirement to the bonding of absorbers and substrate is a very large temperature range where a good mechanical a...

Anodic bonding is quite popular in making microsensors since it can bond sodium-rich glass to silicon or virtually any metals with good adhesion strength in lower temperature. It is well known that this process will introduce thermal strain due to different coefficients of thermal expansion between silicon (or other metal) and glass. Yet its effects have not been well studied. After anodic bond...

Steric vs hydrogen-bonding atropisomerization control of configurationally stable analogues of the biaryl natural product allocolchicine is described. Intramolecular hydrogen bonding between the C8 hydroxy group and the C7 oxygen functionality in (aR,7R)-diastereomer II of 2 and 4 leads to its thermodynamic stabilization relative to the opposite diastereomer (aR,7S)-I, which is manifested by th...

In this letter, we present a sapphire direct bonding method using plasma surface activation, hydrophilic pre-bonding, and high temperature annealing. Through the combination of sapphire inductively coupled plasma etching and the direct bonding process, a vacuum-sealed cavity employable for high temperature applications is achieved. Cross-sectional scanning electron microscopy (SEM) research of ...

Graphene has excellent mechanical, electrical and thermal properties. Recently, graphene-metal composites have been proposed as a means to combine the properties of metals with those of graphene, leading to mechanically, electrically and thermally functional materials. The understanding of metal-graphene nanocomposites is of critical importance in developing next-generation electrical, thermal ...