Thermal plasmas offer unique advantages for materials processing, such as high fluxes of heat and of reactant species. Recent developments have concentrated on improving control of these fluxes across the boundaries surrounding the thermal plasma. Secondary discharges (hybrid plasma generators) and pulse modulation of the plasma have been some of the approaches for this end. The use of such met...

Zheng classification study based on infrared thermal imaging technology has not been reported before. To detect the relative temperature of viscera and bowels of different syndromes patients with pulmonary disease and to summarize the characteristics of different Zheng classifications, the infrared thermal imaging technology was used in the clinical trial. The results showed that the infrared t...

Technology scaling has brought about dramatic rises in the on-chip power density of modern microprocessors. This has led to greater scrutiny and awareness of thermal management techniques which allows to uphold the thermal integrity of the chip. Higher temperatures or uneven distribution of temperatures result in timing uncertainties which induces performance and reliability concerns for the sy...

The ANU 400m “Big Dish” is familiar to most people in the Renewable Energy Community. The first prototype was completed in 1994 and research and development aimed at supporting and improving the technology has continued within the ANU Solar Thermal Group since then. In 2005, Wizard Power Pty Ltd was established by a Canberra investor in order to take the Big Dish technology to commercial deploy...

The collaboration between Sharp Laboratories of America (SLA), Oregon State University (OSU) and ORNL focused on low thermal budget pulse thermal processing (PTP) technique to develop high performance copper zinc tin sulfide (CZTS) thin film system for advanced photovoltaic (PV) applications, with the goal to develop novel fabrication processes for the manufacture of low-cost, high-performance ...

A Reusable Interface Technology is presented for application to thermal parameter estimation problems. It is applied to the estimation of thermal conductivity of compacted Al2O3 powder without binder. As temperature increases, the thermal conductivity of Al2O3 powder without binder decreases.

INTRODUCTION The Fairchild 8x8 DriverMOS package is based on Molded Leadless Packaging (MLP) technology. This technology has been increasingly used in packaging for power related products due to its low package height, excellent thermal performance with large thermal pads in the center of the package which solder directly to the printed wiring board (PWB) and allow modularity in package design,...