Merkel Cell Polyomavirus (MCV) is a common infectious agent likely to be involved in the pathogenesis of most Merkel cell carcinomas (MCC). Trichodysplasia spinulosa-associated polyomavirus (TSV), which exhibit high seroprevalence in general population, has been detected in trichodysplasia spinulosa (TS) skin lesions suggesting an etiological role for this disease. Previous studies have shown s...

We identified a new polyomavirus in skin lesions from a patient with trichodysplasia spinulosa (TS). Apart from TS being an extremely rare disease, little is known of its epidemiology. On the basis of knowledge regarding other polyomaviruses, we anticipated that infections with trichodysplasia spinulosa-associated polyomavirus (TSV) occur frequently and become symptomatic only in immunocompromi...

Evaluation of Through Silicon Via (TSV) electrical performance is hardly required today to improve heterogeneous 3D chip performance in the frame of a “more than Moore” approach. Accurate modeling of TSV is consequently essential to perform design optimizations and process tuning. This paper proposes a methodology based on RF characterizations and simulations, leading to a frequency dependent a...

Thermal performances of 3D IC integration system-in-package (SiP) with TSV (through silicon via) interposer/chip are investigated based on heat-transfer and CFD (computational fluid dynamic) analyses. Emphases are placed on the determination of (1) the equivalent thermal conductivity of interposers/chips with various copper-filled, aluminum-filled, and polymer w/o filler filled TSV diameters, p...

BACKGROUND Noroviruses are a leading cause of outbreaks globally and the most common cause of service disruption due to ward closures. Temporary suspension of visiting (TSV) is increasingly a recommended public health measure to reduce exposure, transmission and impact during norovirus outbreaks; however, preventing patient-visitor contact may contravene the ethos of person-centred care, and pu...

Through-silicon via (TSV) is a critical element connecting stacked dies in three-dimensional (3D) integration. The mismatch of thermal expansion coefficients between the Cu via and Si can generate significant stresses in the TSV structure to cause reliability problems. In this study, the thermal stress in the TSV structure was measured by the wafer curvature method and its unique stress charact...

3D integration with through-silicon via (TSV) is a promising candidate to perform system-level integration with smaller package size, higher interconnection density, and better performance. TSV fabrication is the key technology to permit communications between various strata of the 3D integration system. TSV fabrication steps, such as etching, isolation, metallization processes, and related fai...

Emerging Infectious Diseases • www.cdc.gov/eid • Vol. 10, No. 12, December 2004 2261 and Hep-2C derive from the same tissue (human Caucasian larynx carcinoma), while Vero and BGM derive from another organ (Africa green monkey kidney). Thus, Hep-2 and Vero cell lines that we used are likely susceptible to TSV if the virus can infect Hep-2C and BGM as reported by Audelo-del-Valle et al. The diffe...

UNLABELLED Tracheotomy is performed in cases of upper airway obstruction or chronic pulmonary disorders. The Tracheotomy Speech Valves (TSV) improve communication and airway hygiene and humidification of tracheotomized patients. AIM To show the low cost Brazilian TSV and its use in speech rehabilitation of tracheotomized patients, to evaluate diaphragm opening resistance and comfort to the pa...

Article history: Received 8 November 2015 Received in revised form 1 March 2016 Accepted 4 March 2016 Available online 5 March 2016 Although thermal-aware Through Silicon Via (TSV) cluster's behavior has been studied extensively, the structure of TSV cluster,which is also critical for heat dissipation in ThreeDimensional IntegratedCircuit (3D IC), is ignored. In this paper, a novel structure of...