This paper reports the successful substrate transfer based on standard IC processing to an alternative substrate e.g. plastic. The device on ultra-thin Si substrate using grinding backside Si and thermo-compression bonding process is proposed. Acceptable electrical performances are achieved means that the substrate transfer process is controlled well. The DC characteristics of nMOSFETs as a fun...

Accurate prediction of the final shape using numerical modeling has been a top priority in the field of sheet and bulk forming. Better shape prediction is the result of a better estimation of the physical stress and strain state. For experimental and numerical investigations of such estimations, simple benchmark processes are used. In this paper a benchmark process involving forging (flattening...

Elastic recovery of the material, called springback, is one of the problems in sheet metal forming of drawpieces, especially with a complex shape. The springback can be influenced by various technological, geometrical, and material parameters. In this paper the results of experimental testing and numerical study are presented. The experiments are conducted on DC04 steel sheets, commonly used in...

In recent years, the studies on the enhancement of the prediction capability of the sheet metal forming simulations have increased remarkably. Among the used models in the finite element simulations, the yield criteria and hardening models have a great importance for the prediction of the formability and springback. The required model parameters are determined by using the several test results,...

Springback in sheet bending is a well-defined phenomenon; however, variation of springback difficult to control causing quality problems especially mass-produced goods such as home appliances. As an alternative straight flanging, the rotary die process offers reduced well geometric variation; there little knowledge literature. The effects parameters on behavior flanging and applied appliance si...