Electroless metal plating in combination with nanochannel-containing templates is a versatile method for the fabrication of metal nanotubes [1]. In contrast to the electrodeposition of metals, electroless plating relies on the surface-selective chemical reduction of a metal precursor [2]. The simultaneous coverage of the whole template surface with metal nanoparticles favors the formation of tu...

Hydrogen embrittlement of SK85 high-strength steel sheets was evaluated through a three-point bending test. The effects electroless Ni–P plating and Ni electroplating on hydrogen were examined with respect to the permeability plated films. On morrow plating, indicates high degree embrittlement, irrespective phosphorus content in film. However, is further suppressed than that which can be attrib...

Advanced hybrid microelectronics require high performance packaging materials and components. Alumina, the most widely used ceramic material in microelectronics, is being replaced by new high performance materials such as aluminum nitride (AlN) and beryllia (BeO). AlN's thermal conductivity is an order of magnitude greater than alumina and it has a thermal expansion coefficient very close to si...

A 3-dimensional porous material prepared by transferring a sponge structure of biomineral is coated nickel via aqueous electroless plating.

Electroless cobalt films have been obtained by deposition using a plating bath containing two reducing agents: dimethylamineborane (DMAB) and sodium hypophosphite. This formulation allows spontaneous activation on copper followed by auto catalytic electroless plating. CoWBP and CoBP films are proposed as diffusion barriers and encapsulation layers, for copper lines and via contacts for ULSI int...

Electroless plating is a chemical reduction process which depends upon the catalytic reduction of a metallic ion in an aqueous solution containing a reducing agent without the use of electricity (1). Cahill (2) showed that the cupric ion could be reduced autocatalytically with formaldehyde in an alkaline solution. Okinaka (3 ) established that the overall reaction of the catalytic copper platin...

in the present study, ni-p-cnt composite coating was successfully fabricated via electroless plating. scanning electron microscopy (sem) was used to characterize the coatings. the effect of cnts concentration in the bath on its content in the composite coatings was studied. furthermore, the corrosion behaviour of the coatings with different contents of cnts was evaluated using tafel polarizatio...

Two commercially available silver inks were inkjet printed to fabricate the seed tracks (seed layers) of radio frequency (RF) circuit structures on a high frequency substrate material. One of them is a nanoparticle based ink, and the other, a non-particle based organic silver complex ink. Subsequent to printing, these seed layers were copper plated using an electroless copper plating process, t...

We propose a novel method to fabricate three-dimensional magnetic microparts, which can be integrated in functional microfluidic networks and lab-on-a-chip devices, by the combination of two-photon microfabrication and selective electroless plating. In our experiments, magnetic microparts could be successfully fabricated by optimizing various experimental conditions of electroless plating. In a...