Electroless nickel (Ni) immersion gold (Au), commonly referred to by the acronym ENIG, is most common protective coating applied on exposed copper (Cu) traces of printed circuit boards (PCBs). In this work, we elucidate local corrosion mechanism ENIG-Cu system applying microscopic, surface analysis and electrochemical techniques with high spatial resolution provide a comprehensive understanding...

the effect of an electroless ni-cu-p coating on the fatigue behavior of quenched and tempered ck45 steel has been investigated. the fatigue tests under rotating bending conditions have been conducted in three different conditions of uncoated, as-deposited and shot peened prior to the coating deposition. the results indicate that plating of the base steel leads to a fatigue life reduction. the d...

Abstract: Electroless Nickel (EN) composite coatings embedded with Cr2O3 and/or MoS2 particles were deposited to combine the characters of both Cr2O3 and MoS2 into one coating in this study. The effects of the co-deposited particles on corrosion behavior of the coating in 3.5% NaCl media were investigated. The results showed that both Ni-P and Ni-P composite coatings had significant improvement...

Cu-filled TSV (through silicon via) is important technology for 3-D LSIs in order to obtain higher packing density, faster signal transmission, and lower power consumption. Diameter of TSV is expected to be smaller than 2 μm, and its aspect ratio to be larger than 10 in near future [1]. For realizing a high aspect ratio Cu-filled TSV, it is essentially important to form the barrier and seed lay...

The growth kinetics of intermetallic compound layers formed between eutectic Sn–58Bi solder and (Cu, electroless Ni–P/Cu) substrate were investigated at temperature between 70 and 120◦C for 1 to 60 days. The layer growth of intermetallic compound in the couple of the Sn–58Bi/Cu and Sn–58Bi/electroless Ni–P system satisfied the parabolic law at given temperature range. As a whole, because the va...

Very often electroless electrolytes contribute to wastewater treatment problems. These electrolytes are used in electroless plating processes, which contain a variety of chemicals to meet special surface treatment requirements. Metal salts produce the base material for metal deposition and hypophosphite is delivering the electrons for the metal reduction process – it is basically the internal e...

Cu-Ag particles with homogeneous cover-silver layer were synthesized by electroless plating of copper particles with silver sulfate using eco-friendly sodium citrate (SC) as reducing agent, dispersant and chelating agent in an aqueous system. The influences of sodium citrate/Cu and sodium citrate/Ag ratios on Ag coatings of Cu powders were investigated. Ag formed a dense coating on the surface ...

A novel technique for obtaining nonanomalous Ni-Zn-P coatings with high Ni content ~74 wt % as compared to 15-20 wt % in the conventional plating method! has been developed. These coatings show promise as a replacement for Cd in sacrificially protecting steel. Ni-Zn-P coatings were deposited using an electroless method from a solution containing NiSO4 , complexing agent and ammonium chloride. V...

Electroless composite coatings used for achieving of high hardness, lubrication properties, non-stick surface, abrasive coating applications that by impregnation of soft and hard particles into Ni matrix. Electroless Nickel-phosphorous coatings properties and performance is greatly affected by the amount of phosphorus in them. The phosphor in this coating usually varies from 1 to 13 percent. In...

In this paper, the authors present an experimental study of roughness characteristics of electroless Ni-B coatings and optimization of the coating process parameters based on L27 Taguchi orthogonal design. Three coating process parameters are considered viz. bath temperature, reducing agent concentration, and nickel source concentration. It is observed that concentration of reducing agent toget...